Electronics Forum: heating (Page 88 of 301)

Reflow Oven Selection

Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian

We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so

Leadfree Trials

Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine

were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co

Batch Ovens

Electronics Forum | Sat Nov 05 03:33:28 EST 2005 | grantp

Hi, I might not have been clear in my previous post on this, and the problem we saw is the hot metal of the oven walls caused IR transmission of heat into the board, and thats why the point in time from the start of the profile to the point the PCB

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 03:47:46 EST 2005 | gpaelmo

Anyone have problems wave soldering white tin finish? We are an ems and our customer provides us the pcb's. SMT and TH components on the board. SMT is fine but when we wave solder, wetting to top side is very poor (solder only flows half way up). We

PACE TF1500 or 1700 BGA Rework feedback

Electronics Forum | Fri Feb 24 10:33:13 EST 2006 | MikeL

I know what you mean. Saw this in systems where cooling was not done through the reflow nozzle (i.e. PACE). What happens is that as you run 1-2 profiles, the metal parts along the pathway of the hot air (before it comes out of the nozzle) act as he

Jig for PCB

Electronics Forum | Tue Apr 18 12:34:15 EDT 2006 | Chunks

Outside the box: Can you retro your oven with a belt chain combo? I always order my ovens this way just in case. No pallet or carrier needed then. Can justify retro against the cost of the pallet or carrier. Two part epoxy instead of heat cure?

Reflow Oven Profiling

Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC

Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w

Reflow Oven Profiling

Electronics Forum | Wed May 10 00:42:10 EDT 2006 | Chris

I agree with all of you. If it is a good forced convection oven, the bottom side of the PCB will get very close to reflow temp and will probably reach reflow temp. Plus your oven may fight your settings. The lower heater temp settings will never b

Issues with No Clean Resdue??

Electronics Forum | Thu May 11 15:11:14 EDT 2006 | patrickbruneel

I assume you talk about wave soldering. No-clean fluxes are widely used since 1987 or earlier and after all these years they have proven to be reliable. If you clean the board or not the dust bunnies etc. will still reach the board surface. If you us

SMT Assembly Line

Electronics Forum | Sat May 27 17:21:43 EDT 2006 | smt_guru

Efren, Allow me to make some recommendations. This is my firm's bread and butter, so to speak. Helping startups like yourself achieve their budget objectives, but in the process being innovative and thinking outside of the box. Here are my sugges


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