Electronics Forum | Fri Mar 09 05:06:09 EST 2012 | grahamcooper22
Is your solder paste deposit drying out? Or if the paste deposit is small or there is insufficient paste then the tack between the device and paste will be poor so it can easily come out of the paste during its placement or placement of other parts.
Electronics Forum | Fri Feb 08 16:21:15 EST 2013 | spitkis2
Are you doing this to minimize solder paste splattering? Is this a value that you use for all QFN's (would the overall size of a QFN matter)? I was told reducing placement force with these components is recommended so just was wondering what is bein
Electronics Forum | Wed Apr 22 05:33:06 EDT 2015 | mbb
We'have been working on an issue regarding aluminium capacitor placement in PCB. In fact, we have twisted (shifted) capacitors. Through root causes analysis, we confirmed that this phenomenon is happening during reflow process (no issue on placement
Electronics Forum | Wed Jan 20 09:12:03 EST 2016 | anel_elektronik
Hallo, Following problem with CP40CV conveyor: If I start production, put first PCB and after placement PCB is transported to the output of conveyor and I take it out. Next PCB after placement is waiting endless. All sensors are ok. Looks as if t
Electronics Forum | Tue Jul 19 14:20:47 EDT 2016 | pavel_murtishev
Hyng, Could you please specify exact model number for Siemens? Panasonic is famous for quite high field proven stability. Vacuum pumps for placement heads instead of ejectors is standard option for Panasonic, for instance. I would choose them. An
Electronics Forum | Fri Nov 10 04:53:52 EST 2017 | vinitverma
Normally when you just rotate one of the boards (circuit) by 180 deg, you'll find all the placements shifted by complete board length in X direction. This is because the board is rotated 180 deg with the board origin as the pivot. So you'll need to a
Electronics Forum | Thu Mar 15 13:39:06 EDT 2018 | gregp
Impact is the instantaneous force at the time the component first reaches the PCB. F=M*a....so the acceleration is the key factor. If charted on a graph it would look like a spike...higher force for a short duration. The placement force is typical
Electronics Forum | Wed Apr 11 20:27:34 EDT 2018 | kellogs54
Hi All, Sorry if this seems a stupid question but we been having a huge amount or parts rejected on our placement machines. I started looking at the placement program and found the part tolerance date seems to tight. Before I go and open the tolera
Electronics Forum | Thu Dec 20 07:08:07 EST 2018 | robl
Hi Prem, OK... Is it definitely ok before the oven, as it's a big part to move. Never had an issue with them. Has the part got the correct z height on or is the paste being displaced on placement What machine are you placing it with (is it laser
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
