Electronics Forum: like (Page 880 of 1214)

x-y data generation

Electronics Forum | Tue Feb 01 11:34:55 EST 2005 | Dougs

Has anyone heard of any software that can be used to clean up or manipulate x-y placement data. We are a small contract manufacturer with various customers, some who supply good x-y data to component centres and some who supply x-y data to a pin or

x-y data generation

Electronics Forum | Wed Jul 06 09:51:23 EDT 2005 | Jack

Doug, It always seems easier to fix one or two problems by eye at the time. The real problem comes when the customer wants the same board run again later. You're okay if you saved the corrected placement routine, but if you end up moving the job t

Do we have to go lead free???

Electronics Forum | Tue Feb 01 15:54:53 EST 2005 | jbrower

Hi George, The simple answer is that if you're company only does business in the US, or South america or Antartica or any where else that you aren't frozen out due to RoHS and the WEEE directives, then going lead free may not make sense. Unless your

Reball BGA process flow

Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS

Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of

Traceability

Electronics Forum | Tue Feb 08 22:37:03 EST 2005 | davef

Your company has chosen to define its requirements for tracebility as it has. So, people there should be able to help you understand their purpose and intent. For instance: * We distinguish between 'repair' and 'rework'. Repair requires a MRB ac

Set Command Variables

Electronics Forum | Wed Feb 09 10:32:49 EST 2005 | primus

Hello there! I am familiar with the Set Command Variables available on our older UIC through-hole machines, and am investigating the possibility of making these variables available to our operators. Over the past years, our operators have been train

SMT component mis-aligned

Electronics Forum | Mon Feb 21 13:57:37 EST 2005 | JB

Start by verifying the component definition, the thickness is critical. HSP 4796 uses nozzle 81 for 0402's. Make sure is using the right nozzle. If you need to, use the autoteach function to physically teach the dimensions of it, thickness included.

Shelf Life of Components (solderability)

Electronics Forum | Tue Feb 15 18:09:45 EST 2005 | GS

Hello everybody, according to your experience, what is the allowed or suggested (by Suplliers,or Standards,or best pratics) shelf life for components (SMD/PTH) from fabbrication date to the soldering date ? Let's consider best case when compon

Shelf Life of Components (solderability)

Electronics Forum | Wed Feb 16 08:15:32 EST 2005 | GS

Thank you Dave, that is almost the asnswers we use to give to our Customers when auditing they ask for component shelf life. But as you can imagine, they whant to see a quick information right on the label (on Reels, on trays, etc) like: Use b

Solder paste height checking

Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS

First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the


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