Electronics Forum | Tue Sep 14 18:27:37 EDT 2004 | MikeF
I would need a little more information to be able to rule out some of the possible causes. Have you checked to see if the pins with the minimal solder have anything in common, do all have traces to them? or internal power or ground plane connections?
Electronics Forum | Thu Nov 03 14:23:58 EST 2005 | Samir Nagheenanajar
Thank you for the advice. I am not so concerned with the "2nd reflow", as the same can be said for double sided reflowed PCBA's (the bottom-side parts essentially go through a 2nd reflow). As for the HASL, there is a formula in calculating how much
Electronics Forum | Thu Jul 27 12:20:33 EDT 2006 | David
Hello all, We have customer who wants to produce boards 0.4 mm thick. But they have not allowed to put into the panel. Board has not regular shape so without pallet it is not possible to produce. I made pallet where is pocket the same shape as boar
Electronics Forum | Tue Jul 10 11:49:20 EDT 2007 | samir
Parallelism tends to drift: �h After preventative maintenance �h From dross buildup or other obstruction clogging either wave Parallelism should at least be studied during the process characterization stage, so that you know your machine's process
Electronics Forum | Wed Aug 20 08:23:36 EDT 2008 | davef
Your tantalum capacitor supplier offers the best advice. We're not sure of the package that you plan to use. * If you are referring to molded package, surface mount, tantalum caps, yes, they can be wave soldered. Smaller case size chips (eg, Kemet A
Electronics Forum | Fri Mar 06 07:15:38 EST 2015 | saoasasd
Hi, I have faced some problems with DQFN PACKAGE 132 PIN. After some cross sections and dye pry analysis we could find a head on pillow situation always on inner row pads. The PCBAs are double side and the DQFNs are assembled on Bottom side (Noteboo
Electronics Forum | Mon Feb 09 09:45:16 EST 2015 | saoasasd
Thanks for the support Jax. Our current scenario: Baking - Not allowed for PCBs Washing - Not allowed Heat Cycles - 2 (Bottom and top side). It's a notebook board Our concern is related to solderability because OSP finishing will be seriously imp
Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter
Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at
Electronics Forum | Tue Jan 31 08:28:29 EST 2017 | emeto
That is why we don't care if it is Top or Bottom. We call them first (process) side and second (process) side. Often you will have tall and heavy parts on both sides, so you will have to glue them.
Electronics Forum | Fri Dec 08 12:13:22 EST 2006 | ganoi
Sure would. We discussed applying the glue on the sides rather bottom of the part. Hopefully the seating of the part during P&P helps push it down. Certainly there will be still some gap as some of the glue will be under the part. Each experiment off
