Electronics Forum | Fri Mar 31 15:49:51 EST 2006 | GS
Hi Marcus, by using SN100C have you seen any tearing phenomena like what shown on the link ? http://www.smartgroup.org/pdf/Defect01.pdf Tnks Regards.........GS
Electronics Forum | Thu Apr 06 17:42:59 EDT 2006 | GS
found this interesting comparison (SAC305 SN100C) http://www.nihonsuperior.co.jp/english/data/pdf/nse2_1.pdf Regards..........GS
Electronics Forum | Mon Apr 10 13:10:06 EDT 2006 | Marcus
No I have seen Zero hot tears. Thats with water soluble or No-Clean. We have built over 10,000 boards.
Electronics Forum | Thu May 25 18:59:12 EDT 2006 | Tony S.
We are using the Kester 979 with excellent results; the bonus is that it can be cleaned w/Di water.
Electronics Forum | Mon Sep 04 18:45:57 EDT 2006 | darby
No, No, I'm sorry I can't. I still haven't stopped laughing. Streckfuss, Beautiful.
Electronics Forum | Fri Sep 14 06:17:48 EDT 2012 | mbnetto
Hi Melissa, thanks for you reply... I'll increase the placement force on this component so that it touchs better the board pad. Maybe it couldnt help due to stencil aperture. Maybe I'll have to change it. If you have more ideas, please share with m
Electronics Forum | Thu Apr 30 14:05:16 EDT 2020 | davef
You're talking about lead forming equipment. GPD Global [ Mary Kohler, Sales & Marketing mkohler at gpd-global.com ] helps support SMTnet Other suppliers are: Manix, Ebso & Manncorp Regards, David Fish [davef] Technical Editor & Customer Advocate
Electronics Forum | Mon Aug 16 16:57:06 EDT 2004 | Shean Dalton
Try to observe the board as it exits the wave, look for solder snapping as the leads finally exit the solder. The surface tension could be such that a "string" of solder stretches away from the wave until it finally breaks. Then, as the string reco
Electronics Forum | Fri Sep 14 12:32:25 EDT 2012 | mark25y2001
just check if the pad and component terminal was traces of solder, if have? try to reduce preheat temp and solder bath temp... reason why solder not adhere because of component lead type, if more heat you apply solder flows and not completely adhere.
Electronics Forum | Mon Jun 25 20:59:51 EDT 2001 | davef
As Wolfgang says: Conveyor speed may be too high. Excuse me for not stripping-out my repetition from your list, but other machine adjustments to consider are: * Using more efficient [higher specific gravity] flux. [Got it!!!] * Adjusting wave shape
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