Electronics Forum | Fri May 29 22:03:49 EDT 1998 | Tom Gervascio
| | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | Someone from the manufacturer read it and contacted me. He told me the problem has
Electronics Forum | Tue Jun 09 00:53:06 EDT 1998 | Dave M
| | | Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | | | Someone from the manufacturer read it and contacted me. He told me the problem
Electronics Forum | Tue Aug 28 12:25:26 EDT 2001 | Steve
To be honest with you, it doesn't really matter how you present the data, as long as you understand what the problems are. Bottom line is who cares what the numbers are unless you are doing something about it. Are you able to track the individual de
Electronics Forum | Tue Sep 18 11:34:36 EDT 2001 | jschake
The tightest spacing between neighboring 0201 components assembled was 8-mils. Please refer to the response for the query entitled �Minimizing Tombstoning Defects� posted by martys, as the response provided there is also relevant to address this que
Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef
Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can
Electronics Forum | Wed Oct 24 14:06:37 EDT 2001 | mparker
If you let your design team leave things up to chance, chances are something will go wrong. You are right to want to take control rather than be lead down an undesirable path by the fab house. Various masks serve certain desirable purposes. You need
Electronics Forum | Fri Nov 09 11:55:49 EST 2001 | mparker
If you are getting solder shorts under a device, how would "hiding" the extra long pad with solder mask help? If the pad can't be seen once the device is in place, it is already "hidden". Getting your customer to redesign the pads may take some time
Electronics Forum | Wed Feb 20 19:57:27 EST 2002 | davef
THIEVING * Layout: I�d guess the surface area of your thieves is not large enough. The pull from the thief is not great enough to over-come the pull from the connector pins and pads. Consider tripling the size of the thief. As you say, reducing t
Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ
Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati
Electronics Forum | Wed Aug 21 18:24:24 EDT 2002 | dragonslayr
surely, a big picture perspective is in order to keep from charging off, tilting at windmills and waning Quixotic. Just to tic ya off a bit more (come on now, smile), would those 2 boards in rework have just one defect each or are there multiple def
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