Electronics Forum | Wed Dec 05 17:43:25 EST 2012 | davef
In order to get started in understanding the basics of wave soldering, read this http://www.ami.ac.uk/courses/topics/0225_wave/index.html Many board assemblers have replaced wave solder machines with selective soldering machines. * Often, modern bo
Electronics Forum | Fri Jan 18 14:06:06 EST 2013 | maurdane
I have some boards that go through the assembly process on our SMT Line mounted on SMT Fixtures. Currently, we are experiencing some quality issues (shifting, tombstones, etc) on some of these assemblies as a result of not being able to keep the PWBs
Electronics Forum | Mon Jul 01 13:19:55 EDT 2013 | emeto
I always look for a toe fillet if the design allows you to. Many times the pad design is close or exactly the size of the leads which makes people to touch it up right away. I told them hundred times not to but...Luckily I have 3D x-ray and I can tel
Electronics Forum | Mon Aug 12 15:56:13 EDT 2013 | pjchonis
Vapor phase soldering systems by Asscon are characterized by special designed heating modules. The thermal mass of the heating modules is designed so that a completely delay-less and direct regulation of the heat/flow/energy transfer to the soldering
Electronics Forum | Tue Sep 10 15:27:30 EDT 2013 | gbarb
I have a design that requires the PCBA to be potted. However I have a shrouded header on the board that I need access to. Is there a way to cover this header during the potting process and then removed the cover after the potting material has cured
Electronics Forum | Wed Dec 04 12:57:01 EST 2013 | markhoch
Thank you for your reply Chris We have the same exact unit. But we've had issues with the cleaning solution leaching into the electrical cabinet and shorting out the PLC. They use a foam weather strip as the only insulation, and the cleaning solutio
Electronics Forum | Thu May 29 14:48:45 EDT 2014 | olek
On one of our designs, we use LEDs Lite-On/LTST-S110TB (SMD). PCB footprint was designed according to manufacturer's recommendations. However, our vendor has problems with assembling these parts. Some parts are tilted, other have bad solder joints or
Electronics Forum | Fri Oct 10 20:56:50 EDT 2014 | jlawson
Main issues... Pad Design Thermal Mismatch Design related to pads effected Moisture and out gassing in substrate / part terminations can move parts slightly during preheat prior to liquidous this get position shift ( smaller the parts more an issue)
Electronics Forum | Fri Oct 03 05:59:20 EDT 2014 | cmchoue
Does anyone well know in "via hole design in ground pad" I have few question that i want to know the answer,thanks. 1.Thermal performance compare about a.Via Full Stuff (top/bottom:solder mask and inside is air) b.Via Half Stuff (bottom:solder mask
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
