Electronics Forum | Sun Sep 12 05:59:32 EDT 1999 | JAX
| Hi All, | | Does any one out there have SPC control on Chip placement Machines? I was wondering what type of parameters we can monitor. We have Siplace here equip with SEC-GEM and a monitoring software. Just curious if anyone has done SPC on Chip
Electronics Forum | Sat Sep 05 08:55:57 EDT 1998 | Dave F
| We are writing to have information about the automatic mounting process of flip-chip. | We want to know if it's possible to mount this type of component(flip-chip) with smt tecnology machines.( Pick and Place Tdk or Samsung machines). | Thanking yo
Electronics Forum | Tue Aug 28 13:46:46 EDT 2001 | mparker
To clarify on "Opportunities"- With 1000 components, the opportunities are far greater than 1000. You have 1 opportunity per component for a component defect i.e. bent lead, damaged part, tested bad, etc. You have a second opportunity per component
Electronics Forum | Thu Mar 06 16:34:54 EST 2003 | msivigny
Hello gregp, IPC released 9850 on October 22, 2002 after the industry came together to standardize a method to determine placement capability as it relates to placement speed. As I'm sure you are aware, the standard gives placement machine manufactur
Electronics Forum | Tue Sep 12 14:35:41 EDT 2017 | deanm
In trying to have things run smoothly with placement, I have to do a lot of theta adjustment to get the rotation right during placement. Even if the part looks good on the PnP machine screen sometimes it places differently than what is shown. If I u
Electronics Forum | Mon Sep 25 08:24:25 EDT 2017 | directx995
At the moment we do it like this: We get .csv or .txt pick and place file and .csv or excel bom file. Then I verify every single placement manualy with BOM and delete placements that are not listed on BOM. (Yes, you are right, I do it for 30 placeme
Electronics Forum | Fri May 20 06:34:09 EDT 2022 | jojoled
Hi, I have JUKI KE/FM760L SMT placer, and have strange behaviour in software : I am unable to delete unused components/FEEDERS. 1.I go to placement data, I create 2 records say 0805 and 0603. 2. Then I go to Component Data and I see 2 compoennts are
Electronics Forum | Thu May 18 23:22:44 EDT 2000 | Micah Newcomb
Jerry, Contact FujiAmerica and ask for their newest product Guide. Some differences are..... IP2 - SMD1 vision (back lighting only, coplanarity check optional) IP3 - SMD3 vision (back, front, coplanarity check optional) IP3 - BGA transport, I
Electronics Forum | Fri Mar 24 10:26:45 EST 2000 | Russ
Sal, Interesting problem, I have found that W.S. pastes tend to have a shorter tack time in real life than what is advertised. Usually the manufacturers specify tack time as after placement let the board sit and then turn it upside down and see if
Electronics Forum | Thu Dec 16 20:55:09 EST 1999 | TNT
Hey Henry, Tombstoning can result from many different conditions: 1. Look at the part placement under a microscope before the board has been reflowed. Is it centered perfectly on the pads? If not, the part might migrate towards one pad during reflow
