Electronics Forum: /02 (Page 898 of 1283)

Re: lead straightening

Electronics Forum | Wed Feb 17 06:43:03 EST 1999 | Kris Wiederhold

| Steve, Thanks for the input, but I'm afraid I'm only allowed a three day turn from DRAM to finished product to include those pesky test failures/repairs. I'm sure you know how that goes. In-house may be the only way for me! By the way, I just

Re: Profiling on populated or unpopulated board?

Electronics Forum | Wed Feb 10 18:17:46 EST 1999 | Earl Moon

| Hi, | | Has anyone found any significant differences on profiling using populated and unpopulated boards? Is it worth sacrificing a board to the profile gods? | | Joe | What's the cost of not doing it. In the same breath, why not wait for a sc

Please send problems with new site

Electronics Forum | Mon Feb 08 08:33:27 EST 1999 | Clifford Peaslee @ SMTnet

Hello all, Now that we have the new site up, we know there will be some bugs here and there, so please email me, so that I can act quickly. Some known problems at this time: 1. web email: cannot read attachments, java folder view doesnt work on all

Re: Die Removal Equipment

Electronics Forum | Sat Feb 06 07:39:30 EST 1999 | Wayne Bracy

| | | I am looking for a piece of equipement that can | safely remove silicon die(200mil by 200mils) from a LTCC board. My present method involves a dental drill which often goes through the dielectric layers and causes scrap. | | | | |

Re: wave soldering surface mount tantalum and ceramic capacitors

Electronics Forum | Fri Feb 05 09:39:58 EST 1999 | Dave F

| Can anyone help me with the pros and cons of trying to wave | solder tantalum and large (1812) ceramic capacitors. I do | know that one may see fractures on larger cermaic caps, but have not seen much on the tantalums. Any insight as to what proble

Re: SMD mounting method

Electronics Forum | Fri Feb 05 04:18:44 EST 1999 | Joni Siipola

| Joni: What is it about your situation with the board/component/process that makes you want to explore alternatives? Dave F Dave: In our case the component is placed on metalled footprint which has via holes to transfer the heat via holes to the

Y2K

Electronics Forum | Wed Feb 03 18:29:58 EST 1999 | Jerry Stafford

Have any of you tested or plan to test your machines for Y2K compliance. I would be interested in what you did or what you plan to do. Which machines? What parameters? It seems that it could be a career limiting move to test without getting manag

Re: electronics components suppliers

Electronics Forum | Tue Feb 23 16:55:43 EST 1999 | Joe Zuchowski

| who do you like to go to as a source of | caps, resistors, ICs, DIPs, connectors | | I'm looking for distributors. | | For I.C.'s I have had good luck with Future/FAI, Arrow, Western Resources, and Vista Mfg. Co. in K.C., Classic, Insight Cap

Re: PWB plating

Electronics Forum | Tue Feb 09 20:32:54 EST 1999 | Chris G.

| There is also the process where thicker levels or solder is being applied directly to the board. This means no solder paste is applied before component placement. Just flux, place, and refow. | | Chris G. | | Can you tell me more about the p

Re: Pace TF700 Rework Machine

Electronics Forum | Wed Feb 03 21:46:33 EST 1999 | Larry Mara

Steve, We are in the same boat--small and limeted on fund.We have a TF200 that pace is letting us demo, seems like good tool that we can add to as we need to.We are going to buy one.Great


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