Electronics Forum | Mon Feb 06 17:58:16 EST 2023 | davef
The September 29, 2022 Express Newsletter [ https://smtnet.com/express/index.cfm?fuseaction=archives&issue=20220929 ] has papers on chip cracking
Electronics Forum | Mon Mar 13 14:43:39 EDT 2023 | tey422
Not sure what you meant by "PCB move behind the mount". You mean "dropped after it's placed onto the board"? If that's the case you should checks your nozzles first, there might be solder paste on the nozzle.
Electronics Forum | Tue Mar 28 14:23:11 EDT 2023 | smith88
Glass Micro BGA- I consistently have chips or micro cracks from the manufacture and some happen during install, what functionality risk do these pose to the product? They pass test... I cannot find an established criteria for this type of component
Electronics Forum | Mon Jul 31 18:41:07 EDT 2023 | emeto
Chip-bonder glue(Loctite 3612 for example) will harden at lower temperature way before paste goes to liquidus stage, so it will hold the part in place.
Electronics Forum | Thu Oct 26 10:48:17 EDT 2023 | bobpan
It depends on the motherboard that you have. Some dont have a battery but have a Dallas BRam chip. Bob
Electronics Forum | Fri Apr 05 01:25:14 EDT 2024 | ddfreeze
My research taught me that most older 486 motherboards have a similar CMOS substitution chip that you can purchase, or modify the one you have with a battery as shown.
Electronics Forum | Fri Apr 05 01:34:09 EDT 2024 | ddfreeze
the F1 bios menu thing did not work no matter what options I chose. The fix is to do the mod to the CMOS chip, or gamble on a substitute replacement.
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Mon Aug 24 08:44:52 EDT 1998 | Justin Medernach
| | | Require a conductive adhesive - either isotropic or anisotrpic - which can be used for 100micron oitch devices. | | | Must be resistant to solvents such as MEK and acetone. | | | Cure below 150C, with possible potential for rework of the conec
Electronics Forum | Wed Jul 22 05:54:41 EDT 2015 | langkeauto2015
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