Electronics Forum | Fri Apr 04 05:04:49 EST 2003 | iman
10Mohm DI washing. On the paste supplier recommendation, we sent sampling boards for Ionic Contamination test with specs
Electronics Forum | Fri Apr 04 10:02:20 EST 2003 | rdr
Do you reflow both sides of the boards before washing? Sometimes these white residues occur from "burnt" flux. we see this from time to time especially when using hot air and liquid flux. Russ
Electronics Forum | Tue Apr 08 12:38:12 EDT 2003 | Denise
I'm looking for comparison data on MTBF for solder joints meeting IPC Class II vs Class III.
Electronics Forum | Thu May 01 17:25:10 EDT 2003 | davef
Our first choice in determining the composition of metals would be to use Scanning Electron Microscopy (SEM) / Energy Dispersive Spectroscopy (EDS) analysis.
Electronics Forum | Thu May 01 23:08:37 EDT 2003 | caldon
Dave's point is right on the money. This would be a destructive test..needing microsectioning. Cal Communications Test Design, Inc
Electronics Forum | Thu May 01 23:08:55 EDT 2003 | caldon
Dave's point is right on the money. This would be a destructive test..needing microsectioning. Cal Communications Test Design, Inc
Electronics Forum | Tue Jul 22 02:33:36 EDT 2003 | iman
Dave F, thats' the path of thought we are now bumbling along, but no way is the paste vendor is going to admit straight out to any such affirmation. Any literature online on this possible root cause? as it helps to gain substain-able theory in ha
Electronics Forum | Thu Aug 21 12:31:54 EDT 2003 | adlsmt
I have some finished boards that I have concluded have "black pad" defect. Outside of the black crap on some of the solder joints, if the boards are electrically functional, are they reliable? Any opinions would be appreciated as I dont want to throw
Electronics Forum | Mon Sep 22 13:18:59 EDT 2003 | pjc
I remember reading something about that a while back. The paper said vibration created a higher percentage of voids in solder joints.
Electronics Forum | Tue Oct 21 09:28:11 EDT 2003 | bwet
In terms of an outgoing QC measurement does anyone have some guidance? If ppm defect rates are established is it per board or per solder joint? We are a contract manufacturter trying to establish such a measurements without having to cover old ground
