Electronics Forum: /09 (Page 904 of 1632)

Looking for Filled via -- Embedded within pad - criteria

Electronics Forum | Thu Sep 02 22:23:44 EDT 2004 | davef

Dunno about something formal. After you specify your hole size and fill material, why not say something like: " Surface to be planar prior to final plating and metallization. Boards must be suitable for via in pad technology." We do not allow plati

Gold contamination: MOSFET lead pre-tinning

Electronics Forum | Thu Sep 02 18:39:48 EDT 2004 | steveg

We're having a lot of problems with failed solder joints to gold-plated MOSFET leads. Gold plate thickness spec is 60uin, but we've seen as much as 200uin in cross-section, so we're obviously concerned about gold embrittlement issues. Pre-tinning w

MLCC crack detection

Electronics Forum | Mon Sep 06 04:42:18 EDT 2004 | KenF

Thx for the replies. Acutally I am doing a process related study to see whether the process (pcb depanelling)can induce crack to an MLCC. After depanelling, I will do a thermal shock on the MLCC based on IEC 384-1, that is, five cycles of 30min at hi

looking for info about software tools for embedded systems

Electronics Forum | Mon Sep 06 15:54:53 EDT 2004 | pluppie

Hi, I have to make a presentation about software tools for embedded systems. I've been surfing around but can't find any non-commercial interesting website. If anyone knows some good info, you would make my day. My email is foefeltje@hotmail.Com

Mixed capacitor values on one reel

Electronics Forum | Wed Sep 08 02:31:17 EDT 2004 | Darby

Check any inventory you have of 0805 3p9 capacitors manufactured by Exxxx in Europe. Batch # 1878029. Mixed values of 3p9 and 220pf are possibly on the one reel. I have never come across this before but we have found 5 reels where this is definite af

Solder Mask vs Solder Balls

Electronics Forum | Sun Sep 12 21:31:49 EDT 2004 | Jim

MAke a new stencile and have the aperatures reduced by 20% in X and Y. This has solved 90% of all solder balling issues I have ever dealt with. Be careful with your fine pitch and micro-BGA's. If you are not having problems with fine pitch and 1:1

Universal RAD 5 Tooling Breaking

Electronics Forum | Fri Sep 10 14:25:07 EDT 2004 | Claude_Couture

We had the same problems a few years back. We complained and they came back with the excuse that the supplier of the parts had made a bad batch. They sent us a new part in exchange of the broken one. When faced with premature breakage of parts that a

Print solder paste on test pad on OSP board

Electronics Forum | Tue Sep 14 08:14:07 EDT 2004 | Rob

Hi, There are "Fluxbuster" or "Rotator" pins on the market - we had to use them a few years ago on a flexy board (with OSP). There is some info from one source at the following link: http://www.isiconnectors.com/mfrs/idi/idipr.htm#Rotator We got

Lifted Lead

Electronics Forum | Mon Sep 13 10:39:50 EDT 2004 | Marie

Suggest looking at the packaging,is it sufficient to prevent damage to the QFP?. What way are these components stored when received?.Are the reels stored in boxes or racks?.Storage in boxes may cause damage from stacking the reels on top of each oth

MPM

Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc

MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The


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