Electronics Forum: /09 (Page 905 of 1632)

Lifted Lead

Electronics Forum | Mon Sep 13 10:39:50 EDT 2004 | Marie

Suggest looking at the packaging,is it sufficient to prevent damage to the QFP?. What way are these components stored when received?.Are the reels stored in boxes or racks?.Storage in boxes may cause damage from stacking the reels on top of each oth

MPM

Electronics Forum | Tue Sep 14 10:24:53 EDT 2004 | pjc

MPM is a printing machine design and mfg company based in Franklin MA USA. Printing machines are used to deposit hi viscosity materials such as solderpaste, adhesives and silver epoxy used by the electronics assembly and semi-conductor industry. The

Labeling of SMT solder stencils

Electronics Forum | Tue Sep 14 13:40:50 EDT 2004 | paul_boxboro

I feel your pain. Your company may already be using Kapton tape labels for their board serial numbers labels. Kapton is able to withstand repeated wash and heat cycles, and can be printed on a typical Zebra printer. The key to a successful and accura

Evaluating / Qualifying Solder Paste

Electronics Forum | Wed Sep 15 08:14:18 EDT 2004 | Rick J

Hi, I am planning to evaluate and qualify solder paste that we never used before. What are the test data that I need to request from the paste manufacturer for our QA prior to evaluation? And is there anything that you could provide me such as ideas

Evaluating / Qualifying Solder Paste

Electronics Forum | Mon Sep 20 16:27:58 EDT 2004 | blnorman

Besides the processing tests (different print speeds, print delay times, etc.) one test we've had to use is humidity exposure. Solderballing due to high outside humidity is a problem in our plant. So we expose paste to 85% humidity for various time

NEED DEPANELIZING MACHINE

Electronics Forum | Wed Sep 15 12:18:56 EDT 2004 | haviland

Sue--Good morning. We deal in used and reconditioned assembly machinery and have a Cencorp TR2100 Router (Dual board holder--shuttle style system) that needs a few parts reinstalled in our warehouse in the Chicago suburbs. There are others available.

Has anyone seen info On Reflow Reflow Soldering

Electronics Forum | Wed Sep 15 13:28:05 EDT 2004 | Oscar Cortes

Has anyone seen information on the Reflow Reflow soldering method, without using glue? Currently run a Fuji 241 XP and Ecra Paster, however we do not have the glue attachments for double sided boards. I've heard double sided boards can be reflowed

Open BGA joint

Electronics Forum | Wed Sep 15 13:55:06 EDT 2004 | dave

Due to some reason there are few balls of the BGA left open during the process. Reflow profile has been verified. There are other BGAs on the PCB and they are fine too. The BGA in question has a very large metal heat sink on top of it and is placed r

component baking process

Electronics Forum | Sun Sep 19 19:51:31 EDT 2004 | aaronrobinson

thanks for your reply ....yes the air is then able to hold more water vapour.... but so is the component hence there is no water vapour pressure difference and the component and the air in the oven would still be in equilibrium???? hence no effective

Stencil design for flex-rigid PWB

Electronics Forum | Mon Sep 20 06:21:05 EDT 2004 | C Lampron

Hi Chris, Acually, it worked pretty good. We made a new blade from SS. We were not sure if it would work so we diddn't want to commit a good sqeegee blade. You will want to try to keep the cutaway toward the center of the blade. And don't hit the fl


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