Electronics Forum: any (Page 906 of 1647)

Mixing no-clean solder with activated

Electronics Forum | Wed Jun 27 10:17:46 EDT 2001 | genny

OK....I now fully understand the difference in chemical makeup between rosin and resin. But....can you, or would you, mix them without any concern? Could you or someone please just give me a straight yes or no answer? Please? Of course,... I woul

What Else Are They Good For?

Electronics Forum | Fri Jun 22 13:13:54 EDT 2001 | dougt

I worked as a tech for a company that produced momagraphy equipment about 5 years ago. Every so often we had a problem with a board that was suspected to be the board material itself and used the mamography equipment to check this. In some cases it

Low cost BGA inspection?

Electronics Forum | Thu Jun 21 07:06:18 EDT 2001 | gdstanton

I'm constantly being flooded with information by sales reps on x-ray and other types of equipment to inspect BGAs. Most of these items are simply beyond our capital budget constraints. I've witnessed dozens of demos, and to be honest, I really don'

Non-Waveable SMT Caps

Electronics Forum | Mon Jun 25 10:06:35 EDT 2001 | dave f

are you saying to put a gap in between the board and the stencil? i have been fighting solder balls for a while now. sometimes i can fix them by placement "z" in the machines other times i can't. what should i have my oven profile look like? i have m

Dream Machine

Electronics Forum | Fri Jun 29 14:50:49 EDT 2001 | dougt

Imagine shopping for a machine like an automobile. Your able to go for a test drive with out a week long class and the gas mileage they advertise is realistic and comparable from machine to machine. All machines have similar options that weren't ju

no contact on BGA

Electronics Forum | Tue Jun 26 16:43:19 EDT 2001 | CPI

Yes a 6 mil solder deposite will reduce to approx 50% of it's original size. Does this happen on only 1 BGA? Is the BGA that its happening on have smaller balls than the others, what I'm getting to is, are you sure you are depositing the proper amo

component aherence force on the solder paste before reflow

Electronics Forum | Mon Jul 02 06:01:22 EDT 2001 | wbu

Well, I�ve never encountered any problems with it. If you use paste in the specified window according time and environment there should be no problem. If you try to measure this force you would IMO check out if you yourself did not treat the paste as

Wicking-solder found under mask

Electronics Forum | Mon Jul 16 22:40:02 EDT 2001 | davef

Speaking of people we'd like to pimp slap, why did the not-so-quality guy decide to ship defective units, anywho? This sorta says we can't blame the customer any longer. So, it's either blame the fabricator or umm er, sorry to say this ... YOU DL,

3D Vision vs 2D vision

Electronics Forum | Thu Jul 12 13:37:18 EDT 2001 | markc

I can't comment on the quality of any vendors equipment, but your question is really a "process approach" issue. What do you expect to find with that 3rd dimensional measurement? 2D inspection should detect the majority of your printing errors.

Cleaning stencils after printing SMD adhesives

Electronics Forum | Thu Jul 12 10:18:11 EDT 2001 | Hussman

Ummm...why not use Loctite 7360 Surface Mount Adhesive Cleaner? It's designed to remove adhesive and works great. Low oder and can be bought in 500ml cans for hand cleaning. Part# 25658. Use it why any dry wipe. Do not use alcohol to clean this


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