Electronics Forum | Fri Jul 13 00:11:41 EDT 2001 | qinongzhu
We are preparing a batch of samples for test. several IC which packaged by BGA/CSP was removed from PCB by reworkstation. However, I need to re-use this IC. I want to know whether there is a way to remove the solder balls from these IC devices and ca
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki
Electronics Forum | Tue Jul 31 18:49:20 EDT 2001 | arsmoriendi
i have a problem with some units that had one capacitor only soldered in one side, the geometry of the capacitor is 0805, our product during his life suffer a lot of stress (due temperature or vibration), some of those units are already with the cost
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Tue Feb 01 21:53:06 EST 2000 | Dave F
Emmanuel: You have choices to prevent the solder paste from flowing to the second side during reflow: 1 Have your board fabricator plug the vias. 2 Put a temporary solder mask on the secondary side vias. 3 Have your designer relay-out the vias unde
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Sun Jan 30 21:56:05 EST 2000 | Paulvannan
We used Promosol Sn96.5/Ag 3.5 during our initial qualification for similar application. We could not achieve a shiny solder joint. Our changes to Sn95.5/Ag 4.5 does not improve the look. In order to confirm the reliability of the joint, I suggest yo
Electronics Forum | Tue Jan 25 13:06:47 EST 2000 | Bill Schreiber
When switching from cleaning RMA to a no-clean flux, one area that is commonly overlooked is the stencil cleaning operation. Stencil cleaners that are effective in cleaning RMA often fail when cleaning no-clean (especially alcohol cleaners). Pallet
Electronics Forum | Mon Jan 17 18:36:26 EST 2000 | William
Voids can be acceptable @ 24% per 5 balls area, and 8% per single ball area. In fact, Proceeding Book 1996; Vol. I, Page #126 conclusions saids: that solder joint voiding at the maximun levels pbserved in this study (were voided area was up to 24 per
