Electronics Forum | Wed Sep 15 17:53:53 EDT 2004 | aaronrobinson
My question is how does heat alone (125DegC for 48hours) diffuse the water vapour in a component, I figure the amount of water vapour in grams per cubic cm will be the same regardless of temp...yes with temp the RH changes but once the component rea
Electronics Forum | Thu Jan 06 06:15:49 EST 2005 | mattkehoe
We need some opinions about a situation that is causing problems in our process. The pcb's in question are .125 thick with a HASL finish. The boards are coming in with a large amount of solder trapped inside the via holes. Sometimes this solder is ac
Electronics Forum | Mon Jan 10 11:08:39 EST 2005 | mrgman9999
We are having a problem with popcorning of a plastic BGA that has been under careful humidity control. We have had problems in the past and some have been related to too much trapped internal solvents from the die attach epoxy. We did a life time b
Electronics Forum | Mon Apr 24 19:18:40 EDT 2006 | sessioc
OK guys here is the skinny..... > > We need an > oven that can handle lead free temps without > slowing the belt speed under 28 or so in. per > min. > > BTU tells me that they don't recommend an > oven that maxes any less than 350 C. > > Is an
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Mon Aug 27 12:42:47 EDT 2007 | rgduval
I know this is a little outside of SMT production, but, I'm hoping someone out there can help me with a small issue. I have a product that I'm building that requires 4 .250" wires, with .125" strip on each end. I solder one end to the board, and on
Electronics Forum | Sun Mar 04 09:53:00 EST 2012 | eadthem
What i have on the original 2 problem boards is the parts next to it are SOIC8 and placed using a 125F(.125" dia) 1 of witch is close and we have to Z zone it to place the SOIC last, the others have more than .02" clearance on all sides. The other
Electronics Forum | Sat Sep 10 17:12:18 EDT 2022 | yannick_herzog
Hello, we use an oven to dry our MSL components after the floor lifes expires. The oven works at 40°C / 0.1% RH. The plan is to upgrade the oven from 40°C to 60°C to shorten the duration of the process. I have found a number of articles mentioning
Electronics Forum | Mon Mar 13 15:10:52 EST 2000 | Stuart Adams
Assuming agressive design rules what is the minimum distance I can get away with between the board edge and a SMT pad and between the board edge and a plated mounting hole ??? (The board is only 1"x2" and the mounting holes are 80 mil dia, 125 mil
Electronics Forum | Fri Feb 25 05:42:17 EST 2000 | Istv�n Dominik
Hi, We should wavesolder a PLCC44 package. The PCB is under the design procedure now and we must specify the best parameters (the orientation (45 or 90 degrees) of the package on the PCB,the number, the positon and the size of the solder thief pads
