Electronics Forum | Fri May 02 08:50:08 EDT 2008 | realchunks
You're not the only one. We just got done with a batch of ICs that had a high reject rate at placement. The machine was rejecting about 70% of the parts because it didn't recognize the part. The reason it didn't recognize the part was due to the f
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Thu Feb 28 14:32:13 EST 2008 | cyber_wolf
Let me re-state the last part.... The throwing out part is paste dependent.
Electronics Forum | Fri Nov 19 10:14:30 EST 2004 | steve
A customer of mine is having problem. They can't control their humidity. It is very dry. RH averages 28-30%. The water soluble solder paste prints great. But dries out on metal squeegee. Any suggestions.
Electronics Forum | Tue Aug 20 21:46:09 EDT 2002 | davef
Rinse => OSP Coat => Rinse => Dry Hot Air Solder Level: Preclean => Rinse => Flux Coat => Solder Coat => Hot Air Level => Cool => Soft Brush => Post Clean Rinse => Dry Look here http://www.epa.gov/opptintr/dfe/pubs/pwb/ctsasurf/download/pdf/ch2.pdf
Electronics Forum | Thu Jun 19 07:41:25 EDT 2008 | davef
And that's the key thing for an assembler. Who cares if the part is bone dry? Assemblers want to get the part dry enough so that soldering process does not destroy the part, so that he /she can move on to the next issue.
Electronics Forum | Fri Feb 29 07:32:43 EST 2008 | samitokgoz
We have the same problem... We are using water soluable solder paste (Alpha ws609) and it dries out very quick. I don't want to throw out the paste inside the printer, but on the other and I don't want to risk my production by adding flux or alchol o
Electronics Forum | Thu Jan 27 19:14:27 EST 2000 | Dennis
Thanks! It is right that solder paste is somewhat responsible for misssing components in our case. I took a look at the board after placement and I found that component hit the paste, but no where on the board. I guesss dry solder paste (operater pri
Electronics Forum | Thu Feb 12 22:21:08 EST 2015 | shahrat
So what problems you are facing with Mirtec? Can u check coplanarity, less solder, polarity, dry solder,Pads not properly got the heat for 1005 package. Can u also check 0105 components that is surrounded by some tall components? what about false cal
Electronics Forum | Thu Sep 03 07:16:39 EDT 2009 | rocko
When you increase the blade length you have to use much solder paste. As a result, we will dry-out extra quantity of solder paste. If it's not a problem then you can use longer blades, just change/adjust the process parameters.
