Electronics Forum | Wed Jun 10 13:39:56 EDT 1998 | Justin Medernach
| Our company wants to buy a rework station for BGA's. I would like to know what is a good BGA rework station. IR or hot air? Do we need a rework station with optical placement or can BGa's be placed manually during rework. We have seen a demo of an
Electronics Forum | Thu May 07 13:22:37 EDT 1998 | Chrys
| I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am
Electronics Forum | Wed Oct 09 11:59:56 EDT 2002 | slthomas
Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particularly one that focuses on different processes? I'm being asked to produce information from said
Electronics Forum | Wed Oct 09 14:15:56 EDT 2002 | slthomas
Pardon the cross-post from the design board....I thought maybe I should query both populations. Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particu
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Tue Dec 17 12:53:28 EST 2002 | russ
You looked one page to far in the IPC book! Fillet height of 75% is acceptable for all 3 classes. Per IPC 610 rev. C Section 6 table 6.2. A. Circumferential wetting on Primary side (top)between lead and barrel (not anualar ring) Class 1 Not spe
Electronics Forum | Tue Aug 05 18:02:05 EDT 2003 | MikeF
Check the areas that are getting solder on the top side. If you have internal ground planes, and the ground plane pth's are not getting solder on top, and signal pth's are, it's a heat problem. If the ground planes are in the middle of the board yo
Electronics Forum | Thu Aug 21 21:05:39 EDT 2003 | Tom B
Dan, We, do alot of double reflow. Your right we typically see alot of the standards components, SOT's, SOIC's, Chip stuff. The largest we do with out adding epoxy is some 32pin PLCC's. We have several assemblies were were doing PLCC44's, Sockets
Electronics Forum | Wed Dec 22 17:03:23 EST 2004 | jamesd
Shameless? In APE's experience not so - air velocity/power is extremely important in carrying energy to the board and close loop control of that energy is crytical in maintaining a controlled environment - if a machine design requires that air is for
Electronics Forum | Tue May 30 13:50:40 EDT 2006 | Dragan
Hi, I ran into a problem and need a solution. It is a 3cm*4cm*1mm 2 layer PCB (6x6 panel) with a LQFP128 package Microcontroller, a resonator and 2 capacitors. What happens is: When i recieve the assembled pcbs from the assembly plant they wor
