Electronics Forum | Tue Mar 23 23:17:12 EDT 2021 | llawrence
Hello everyone, I work for a company that, up until now, has done everything using through-hole components. This has been fine for years, but we have been pushed into the world of surface mount manufacturing by a new product that is far cheaper and
Electronics Forum | Wed Dec 13 11:15:20 EST 2000 | Travis Slaughter
I�m not sure but it looks like the �mini-chip thingie� is a filter cap if so it should not stop the playstation from working, may not work like you like but should do something. Did you use any static protection? If not you may have fried one or all
Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH
All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o
Electronics Forum | Thu Oct 26 17:48:47 EDT 2000 | Dave F
In response to your questions: 1) Suggestions on substrate material FR-4 or something better? Most PBGA are on BT. That might good for you, also. 2) Are there design guidelines for wire bonding pattern on the substrate? Several things: 1 Doesn�t
Electronics Forum | Mon Jun 19 21:32:15 EDT 2000 | Dave F
Frank: Good luck on finding a specification. The right combination of material properties will greatly improve the lifetime of your flip chip component. Your flip chip supplier might be best starting place to determine underfill properties that ma
Electronics Forum | Tue Feb 13 07:26:26 EST 2001 | doctord
Bill, I can give you suggestions. First and foremost. Print a board and look under a microscope. Are you printing exactly on the pads? If you print on the mask, no matter how good we got the profile, no matter what paste we would get solder balls. Mo
Electronics Forum | Mon Feb 19 01:59:15 EST 2001 | dadi
I'm looking for a Transtarent & Non-Transparent PCI-to-PCI bridge that compliant with the Compact PCI Spec. This bridge must have the ability to be configured as Transparent or Non-Transparent. I aware to one chip that have those abilities. This chip
Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B
We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co
Electronics Forum | Wed Sep 20 09:37:15 EDT 2000 | Erick Russell
Determining cost of rework is based on usage and application. Photonic soldering saves an average of 5 minutes per rework site in process time and may save a significant amount of labor. Depending on volume, and specifics on the application, the cos
Electronics Forum | Fri Jan 14 16:58:20 EST 2000 | Dave F
Dave: You're probably correct about too much paste, given that your balling is congrigated near the center of the chips. Three things to consider: 1 Lower temperature profile @ front 3 zones 2 I've heard some stencil suppliers can plate addition
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