Electronics Forum: designing (Page 92 of 537)

SMD Spring Pins Reflow Crooked / Tilted

Electronics Forum | Mon Jan 09 14:18:51 EST 2017 | ttheis

Thanks for your replies. Customer designed this so we can offer them feedback on the design. Pin manufacturer said most likely too much paste as well. Reducing apeture size would be the easiest solution there. We are running a VIP70 oven with chain r

Tombstone components issue after reflow?

Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics

The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart

I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo

Best way to identify moisture sensitive reels on a machine

Electronics Forum | Thu Jan 25 13:54:51 EST 2018 | emeto

The best way is to have proper system in place that shows which reel is stored where. Now mycronic, juki, fuji and more have these towers(MSD), where you can keep your parts in. It is a very elegant solution with a beautiful software that tells you w

SMT Stencil Design

Electronics Forum | Fri Feb 16 03:11:35 EST 2018 | robl

Hi Ameen, Have you tried talking to your local stencil fabricator? they tend to have rule sets built up over years of experience. We are very lucky in the UK to have excellent, very knowledgeable suppliers. Also, stencil design rules are built in

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 13:53:45 EDT 2018 | dleeper

I've never placed one of these before, but it looks like a poorly designed part. It has pads scattered asymmetrically around the body of the part. when it reflows this is going to apply uneven forces to the component, causing it to skew. I guess hav

New Here

Electronics Forum | Mon Jun 17 23:57:50 EDT 2019 | aite

Hi, Matt this website has a lot of knowledge about PCB design, I believe you can find what you want here. In addition to PCB design knowledge, there are some electronic component suppliers. If you need to buy a product for testing or to make a circ

Need help on improving design - Automatic Pick & Place Coil

Electronics Forum | Mon Aug 06 16:33:52 EDT 2018 | tey422

If I understand customer's intention correctly, it would be fastest, mass production with fully utilizing the Pick-N-Place machine capacity with minimum manual labor which won't break the bank. They used to manual hand soldering the coil to the boar

QFN DROP DURING 2ND TIME REFLOW SOLDERING

Electronics Forum | Mon Mar 11 06:49:42 EDT 2019 | SMTA-Bob

You problem will be related to the part type or the design. Standard 40 or 100 pin QFN or LGA parts are not going to drop due to weight as they are just a few grams. If you send a photo of the PCB pad footprint and the component separately I may be a

Small scale reflow oven

Electronics Forum | Mon Apr 15 06:30:23 EDT 2019 | spoiltforchoice

Its not the max temperature that is the issue, its how much energy the oven is capable of transferring to the PCB inside the 4-6 minute window of a typical profile. In a conveyor oven this is achieved by having zones of different temperatures, but th


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