Electronics Forum | Wed Sep 30 04:36:54 EDT 1998 | Jacqueline Coia
Still cant get a fix to SMD soldering problems, Joints still look strong shiny and well wetted, although when pulled lead still coming away from pad, leaving a dull grainy looking space. This is occuring just after reflow (convection), no other proc
Electronics Forum | Mon Sep 14 17:36:34 EDT 1998 | Robert Steltman
We are looking at a third P&P machine for our factory. I have received brochures on a SMASUNG CP30V machine. It looks great and has all the plus points for a contract manufacturing company such as ourselves. The basic specs are: 14400 cph - 3 heads
Electronics Forum | Wed Jun 10 19:53:01 EDT 1998 | Joe Herz
| The Tesa company delivers Splice Tape for 8mm, | 12mm and 16mm. Also special splice tape for 8mm | paper tape and some splice tools as well. | Siemens uses for large tape a 'staple' but might | be patented and then cannot be used outside Siemens.
Electronics Forum | Sat May 09 11:46:43 EDT 1998 | Bob Willis
The first thing is all the TSOP suppliers like Intel do not rate the parts at normal temperature used in wave soldering. The spec is less than 230C so you have the reliability issue to consider and no one to blame when they do not work. You also have
Electronics Forum | Thu Apr 02 11:19:41 EST 1998 | Justin Medernach
| I am looking for footprint details on a SM crystal. | Package type - Golledge GSX49-4. | Solder method - refolw Mark, Check with the good folks at IPC for land design. The spec should be IPC-SM-782. Also, see http://www.ITM-SMT.com. It's Phil Za
Electronics Forum | Mon Mar 16 09:23:56 EST 1998 | Justin Medernach
| we are looking for paste printing specs.& stencils holes shapes to | perform soldering reliability d.o.e. of the a.m. | subject. | looking forward to your info. | tech. dept. /telrad prod. Call 1 800 4 INDIUM and ask for a sales person. A paper
Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach
| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert
Electronics Forum | Mon Mar 09 15:53:05 EST 1998 | Tom Foley
| I am looking for component placer that can handle not only smc but also flip chip C4. | If there is any machine satisfying my request, please inform me. | machine name , spec, and so on. Take a close look at the Philips ACM. The ACM is engineere
Electronics Forum | Sun Feb 22 02:23:25 EST 1998 | Jon Gruett
Chang, I recommend that you stop by the Siemens booth at the NEPCON West show and see the F4 and F5 machines. I think you will be pleaseantly surprised by what you see. Take some time and really research the next generation of machines that are her
Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault
| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET
