Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 16:06:09 EDT 2004 | Robert Ack
Being a surface mount department manager for well over 6 years I have seen this countless times. While we run mostly water soluble I havent seen any negative issues while running boards through the oven twice. Sometimes we even spray an additional am
Electronics Forum | Wed Aug 25 11:06:58 EDT 2004 | arvind
Please help.. I have seen somewhere a method of placing 0402 part using Mydata machine with standard 8 mm feeder, but I can not find it now. Does any one know how to place 0402 part with 8 mm feeder without loosing every other part? Thanks for any he
Electronics Forum | Wed Aug 25 22:15:44 EDT 2004 | mmk
During BGA rework we are asked to protect adjacent compoennt from secondary and/or partial reflow. That is our normal process. However, the customer is asking that the peak temp of the joint at the adjacent component should not exceed 160C. Can you p
Electronics Forum | Fri Aug 27 04:51:43 EDT 2004 | rose
I suggest you to do some EDX ananlysis or maping and make a comparsion between the delam part and the good one. maybe some contamination or element used in the board manufacturing process stayed under the coating layer. If there is some difference be
Electronics Forum | Sat Aug 28 19:31:36 EDT 2004 | ryufoong
Currently, in my working factory, we facing the flux residue remain on connector after washing. (of course, this is clean process with WS solder paste). So, are there any ways to clean the flux residue rather than go back to wash again? Because wash
Electronics Forum | Tue Aug 31 20:40:43 EDT 2004 | davef
Please excuse us if we seem dense, but we're stuggling to understand your problem. Are you seeking a supplier for pads [like those used to repair boards] that you can epoxy to your board? If so look here: http://www.circuittechctr.com/products/cond
Electronics Forum | Mon Aug 30 13:25:30 EDT 2004 | Steve Gregory
Hi Everyone! I'm going to write a small article for our employee newsletter about the history of mass soldering. I did a search with Google and Wisenut, but found suprisingly few hits. I'm wondering if any of you have any good links that you could s
