Electronics Forum: past (Page 920 of 989)

Re: Micro balls on gold fingers

Electronics Forum | Tue May 19 12:54:55 EDT 1998 | Richard Jackson

| We had a similar problem. But whenever the solder came from the screen printer the solder would wet to the gold fingers, with the help of residual flux. But the problem is balls, that I assume are not wetted to the gold fingers but instead are jus

Re: Drying ICs any advice

Electronics Forum | Fri May 15 14:41:25 EDT 1998 | Terry Burnette 512-933-5783

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:11:19 EDT 1998 | Justin Medernach

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike

| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach

| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package

Re: Approach To Contamination Testing Of PCBs

Electronics Forum | Fri May 15 10:51:12 EDT 1998 | Justin Medernach

| We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | We have no c

Aye aye aye.

Electronics Forum | Fri May 15 12:01:34 EDT 1998 | Justin

| | We understand that testing for ionic contamination and surface insulation resistance measure different properties. We assemble printed circuit boards for other companies. We will not get combs on 90% of the boards that we assemble. | | We have

Re: Need to spec in smt prototype equipment

Electronics Forum | Mon May 18 10:54:46 EDT 1998 | Jerry

If it's really low volume I would only invest in a stencil printer and convection reflow oven to start with. If you want to go really low budget get a manual unit such at one from Transition Automation. Make up some really good shop aids and have s

Re: MI Solder temp & RF routing

Electronics Forum | Thu May 14 21:46:27 EDT 1998 | D.Lange

| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con

Re: Pallet problems

Electronics Forum | Fri May 08 16:30:59 EDT 1998 | Chrys

| I am running boards with gold fingers on a pallet for | masking purposes. The pallets worked fine for a while | but know the gold fingers are getting solder on them. We | have tried everythin: new pallets, cleaning the pallet | and board to be s


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