Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette
Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture
Electronics Forum | Thu Feb 03 20:45:28 EST 2000 | Gary
I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but on
Electronics Forum | Wed Oct 20 16:05:47 EDT 1999 | Mark Charlton
I knew this would happen. Someone wants to rework a bad BGA artwork by cutting a trace and adding a wire under a 292p 1.27mm pitch PBGA. Has anyone done this before? What kind AND size wire do you use? How do you hold it in place during the replc
Electronics Forum | Wed May 05 09:59:44 EDT 1999 | Erick Russell
Several of our customers use our Summit series equipment for this purpose. Our rework stations are used in proto labs to prove manufacturability. Consider it a low volume, semiautomatic pick and place and selective soldering reflow oven. Some low
Electronics Forum | Wed Apr 21 14:29:58 EDT 1999 | joe devaney
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Mar 24 09:22:16 EST 1999 | justin medernach
| We might be doing a job with some plcc, soic on one side and the other side will have two BGA's. Does any one have any ideas on what knid of problems that might occur if we reflowed both sides? Like heat temp, surface tension, etc. Thanks for any h
Electronics Forum | Thu Dec 09 07:46:42 EST 2004 | davef
We did this for BGA pads, but have not thought about other types. So, this may or may not apply for those. Pad defined by:||Advantages||Disadvantages Non-solder mask||No point-of-stress concentration at edge mask and solder ball||Smaller pads have
Electronics Forum | Tue Mar 07 10:46:24 EST 2006 | muse95
I have to disagree with you, BillyD. If Craig searches the forum, he will see that the concept of a Pbfree BGA with SnPb paste has been debated many times. You say it is fine. I say it is NOT. There have been several studies done that clearly sho
Electronics Forum | Tue Apr 25 10:42:38 EDT 2006 | TMC
Almost all of the components on the bottom side are passives however, there are a couple of mBGA's and qfp's. I am aware that even if the components on the bottom do get reflowed, surface tension of solder will hold them in place. As far as IC's, w
Electronics Forum | Thu May 01 10:51:09 EDT 2008 | realchunks
You need a paste designed specifically for this. They are available. Most have 2% silver in them and higher temp flux so you can reflow at "no-lead" temps. The silver aids in the intermaetalic bond and the high temp flux allows you to reflow the n
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