Electronics Forum: preheat (Page 93 of 117)

Re: Metal based PCB reflow.

Electronics Forum | Wed Jun 09 17:29:59 EDT 1999 | Earl Moon

| I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | There is anybody has experience on metal-based PCB reflow process? I guess

Re: Metal based PCB reflow.

Electronics Forum | Thu Jun 10 11:23:10 EDT 1999 | Gang Pan

| | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | There is anybody has experience on metal-based PCB reflow process? I g

Re: BGA rework : IR or convection

Electronics Forum | Wed May 12 10:38:51 EDT 1999 | Glenn Robertson

| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, My experience is primarily wi

Re: BGA rework : IR or convection

Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing

Re: BGA rework : IR or convection

Electronics Forum | Tue May 18 03:03:34 EDT 1999 | Philip B.

| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | My experience i

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon

| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.

Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a

Re: Bench marking Wave Solder

Electronics Forum | Fri Apr 23 14:14:49 EDT 1999 | Chrys Shea

| Hi everybody, | | I would like to bench mark the quality out of our wave soldering m/c as far as DPPM levels are concerned. Can somebody provide me with some figures at their site or anywhere else for the same. | | Thanks | Upinder | ====== | We

Re: Wave soldering machine selection

Electronics Forum | Fri Apr 23 15:10:45 EDT 1999 | Chrys Shea

| We are an assembly house engaged in large volume manufacturing of Computer motherboards and others. We are in the process of selection of a new wave soldering machine. Can somebody help me inform what are the different parameters which must be ens

Discoloring of Soldermask and silkscreen

Electronics Forum | Mon Apr 12 19:28:26 EDT 1999 | Tom B

Netters, When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? 1. Kester 293 no clean 2. 2.1 C/s for 30s to 150 C 3. .5 - .7 C/s for 60s to 185 C 4. 1.5 C/s u


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