Electronics Forum | Tue Mar 16 18:11:54 EDT 2021 | grahamcooper22
I am wondering, I have an application for assembling a 0.4mm WLCSP to a pcb....the solder sphere size is 0.26mm...would you print paste in the normal printing process and then place the device and reflow...or would you use a fluxing station on the pi
Electronics Forum | Mon Mar 26 20:55:16 EST 2001 | davef
Two things: 1 IPC pad calculator is an excellent resource for you and your board layout staff. Consider that working together with the calculator may allow you both an opportunity to balance your interests. 2 It's unlikely that the ceramic parts h
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Wed Jan 14 06:42:38 EST 2004 | tommy
We see spattered(spitting of flux or solder to nearby area) solder/flux on gold fingers.We view the gold fingers area under 30x before reflow and it is cleaned but after reflow we see flux droplets or solder on gold fingers. We tried to changed a new
Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000
We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho
Electronics Forum | Mon Oct 10 17:47:10 EDT 2005 | jhagve
hi We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Tue Oct 11 10:49:14 EDT 2005 | jhagve
HI We start to make a product which have a 0.4 mm pitch IC and start having problems with not enough solder printed, to solve this problem we had to increase the manual cleaning, now we are cleaning the stencil every 8 printings, before we was runnin
Electronics Forum | Fri Jun 20 12:03:25 EDT 2008 | mmjm_1099
Can someone please shed some light on a QP picking problem I am having? It seems I am having to add more and more z offsets in the programs and unsure why. I have to go in and add 0.4 mm into the Z pick because the nozzle isn�t coming down enough. Wh
Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Tue Jun 07 00:21:42 EDT 2011 | jacki
Hi All Currently, we encountered that the schottky barrier diode was up side down or misalignment during SMT process.And, many parts were blown away as pick up error. What we found is its package space is a little bigger for parts to move. I seek y
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