Electronics Forum | Tue Nov 08 05:00:23 EST 2005 | rlackey
Hi CW, Regarding orientation, yes, your diagram is right - see the following link for confirmation. http://search.murata.co.jp/Ceramy/image/img/A18X/C2EB3C.PDF Regarding information on bending strength you want to talk to your local Murata office
Electronics Forum | Thu Jun 29 11:52:23 EDT 2000 | JAX
sree, There is no Definite. You have to make the call. If you think the previous info was on target, use the info provided to find out the appropriate percentage relation between ball diameter, pad diameter, and aperture size. If you already run BGA,
Electronics Forum | Mon Jun 07 21:31:46 EDT 2004 | davef
That's thin board. The test that you ran is the best method for determining the specific answer. Bob Willis says, "Use pad mating to lead wetting area. Some have found the ratio to be as much as 44 grams/sq in." Bob Willis and Phil Zarrow have po
Electronics Forum | Tue Jun 06 11:57:12 EDT 2006 | Chunks
IPC 610 says acceptable Class 1 (Class 2, 3 indicator) if they are entrapped/encpsulated balls within 0.13mm of lands or pads. or exceed 0.13mm in diameter. Defect Class 1,2,3: Solder ball violates min electrical clearance. Solder balls not entrap
Electronics Forum | Fri May 07 17:02:01 EDT 1999 | Earl Moon
| On 1.27mm (0.050 inches) Standard Ball Grid Array's. | The ball size diameter starts at approximately 0.025 inches. | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? | | This
Electronics Forum | Thu May 13 18:36:55 EDT 1999 | Andrew Wulff
| | On 1.27mm (0.050 inches) Standard Ball Grid Array's. | | The ball size diameter starts at approximately 0.025 inches. | | | | If the ball size decreases to 0.012 inches (due to the solder flowing down a via) is the solder connection reliable? |
Electronics Forum | Thu Jun 29 09:29:46 EDT 2000 | JAX
sree, You might want to check the archives. If not, I found this just a few questions below yours!! [Back to thread listing at top] Posted by Igmar on June 22, 2000 at 10:27:26 AM EST Can someone please help with the aperture size on a Micro BGA st
Electronics Forum | Thu Apr 12 01:23:04 EDT 2001 | Eric C
Check the pad size. I had this issue before due to the pad size too wide. R&D had change the size of the pad and is solve the issue. Before the pad size change, I had rebuild another stencil with the pad opening close to the component size. It won't
Electronics Forum | Fri Feb 01 09:34:54 EST 2008 | jdengler
In the PD for 0603 I have a min size of 0.7mm and a max size of 1.0mm and the CP4 size at 0.0mm. This way when you have 1.0mm nozzles in the machine it will use that and when you change them to 0.7mm it will use that. Both sizes work OK. -Jerry
Electronics Forum | Wed Oct 12 08:02:31 EDT 2011 | emeto
It looks like a nozzle size issue. Make sure you have the right nozzle size for the part as well as the right feeder.I think that if the machine takes the parts from the feeders, it can't be feeder problem. Usually parts will jump out of the feeder
