Electronics Forum | Wed Sep 22 22:23:55 EDT 1999 | SY
| | | | | My stencil thickness is 6 mil and we got qfp's with fine pitch. | | | | | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | | | | | | | | | thanks | | | | | | | | | We use 6
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis
You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Oct 04 00:03:28 EDT 2018 | gaintstar
flason smt pick and place machine: http://www.flason-smt.com/product/Hanwha-IC-placer-SM321-High-Speed-SMT-Modular-Chip-Mounter.html http://www.flason-smt.com/product/Hanwha-Pick-and-Place-Machine-DECAN-F2-High-Speed-SMT-Modular-Chip-Mounter.html htt
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