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A20B-2100-0931 ABB NEW &Original PLC-Mall Genuine ABB spare parts global on-time delivery

A20B-2100-0931 ABB NEW &Original PLC-Mall Genuine ABB spare parts global on-time delivery

New Equipment | Industrial Automation

A20B-2100-0931 ABB NEW &Original PLC-Mall Genuine ABB spare parts global on-time delivery CONTACT US: EMAIL:sales2@amikon.cn WEB:www.amikong.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791 Amikon supplys automation s

Amikon HK Automation Tech Limited

HONEYWELL 8C-PAIH54 (51307070-275)

HONEYWELL 8C-PAIH54 (51307070-275)

New Equipment | Industrial Automation

HONEYWELL 8C-PAIH54 (51307070-275) Email:sales2@amikon.cn   Skype: ariatang111 Mb(Whatsapp):+86-18020776791 Wechat:18020776791 QQ:2851195478 Tel:86-592-5321698 Our advantages: SCHNEIDER 140CPU43412U,140CPU65150,140CPU65160,140CPU65160,140CPU6

Amikon HK Automation Tech Limited

IMMFP03B Multifunction Processor - 8 MB ABB Bailey Infi 90 12

IMMFP03B Multifunction Processor - 8 MB ABB Bailey Infi 90 12

New Equipment | Industrial Automation

IMMFP03B MuIMMFP03 Multifunction Processor Module ABB Bailey Infi 90 12 Email:sales2@amikon.cn   Skype: ariatang111 Mb(Whatsapp):+86-18020776791 Wechat:18020776791 QQ:2851195478 Tel:86-592-5321698 Benefits: 1. lower your support costs 2. Provide

Amikon HK Automation Tech Limited

An investigation into low temperature tin-bismuth and tin-bismuth-silver lead-free alloy solder pastes for electronics manufacturing applications

Technical Library | 2013-01-24 19:16:35.0

The electronics industry has mainly adopted the higher melting point Sn3Ag0.5Cu solder alloys for lead-free reflow soldering applications. For applications where temperature sensitive components and boards are used this has created a need to develop low melting point lead-free alloy solder pastes. Tin-bismuth and tin-bismuth-silver containing alloys were used to address the temperature issue with development done on Sn58Bi, Sn57.6Bi0.4Ag, Sn57Bi1Ag lead-free solder alloy pastes. Investigations included paste printing studies, reflow and wetting analysis on different substrates and board surface finishes and head-in-pillow paste performance in addition to paste-in-hole reflow tests. Voiding was also investigated on tin-bismuth and tin-bismuth-silver versus Sn3Ag0.5Cu soldered QFN/MLF/BTC components. Mechanical bond strength testing was also done comparing Sn58Bi, Sn37Pb and Sn3Ag0.5Cu soldered components. The results of the work are reported.

Christopher Associates Inc.

Intermetallic Growth in Tin-Rich Solders

Technical Library | 2017-06-13 17:14:59.0

For tin-rich solder alloys, 200 C (392 F) is an extreme temperature. Intermetallic growth in tin-copper systems is known to occur and is believed to bear a direct relationship to failure mechanisms. This study of morphological changes with time at elevated temperatures was made to determine growth rates of tin-copper intermetallics. Preferred growth directions, rates of thickening, and notable changes in morphology were observed.Each of four tin-base alloys was flowed on copper and exposed to temperatures between 100 C and 200 C for time periods of up to 32 days. Metallographic sections were taken and the intermetallics were examined. Intermetallic layer thickening is characterized by several distinct stages. The initial growth of side plates is extremely rapid and exaggerated. This is followed by retrogression (spheroidization) of the elongated peaks and by general thick-

General Electric

ABB NMFC04 Multifunction Controller - NET 90

ABB NMFC04 Multifunction Controller - NET 90

New Equipment | Industrial Automation

ABB NMFC04 Multifunction Controller - NET 90 CONTACT US: EMAIL:sales2@amikon.cn WEB:www.salsplc.com SKYPE:ariatang111 MB(WHATSAPP):+86-18020776791 WECHAT:18020776791        Our services  Packing & Delivery 1)100% full New! - Original Factory Seal

Moore Automation

sales2@amikon.cn distributor EMAIL: sales2@amikon.cn (Click!) Skype:live:ariatang111 Mb(Whatsapp):+86-18020776791 Wechat:18020776791 QQ:2851195478 --------------------------------------------------------------- RELIA

Effect of Silicone Contamination on Assembly Processes

Technical Library | 2013-02-07 17:01:46.0

Silicone contamination is known to have a negative impact on assembly processes such as soldering, adhesive bonding, coating, and wire bonding. In particular, silicone is known to cause de-wetting of materials from surfaces and can result in adhesive failures. There are many sources for silicone contamination with common sources being mold releases or lubricants on manufacturing tools, offgassing during cure of silicone paste adhesives, and residue from pressure sensitive tape. This effort addresses silicone contamination by quantifying adhesive effects under known silicone contaminations. The first step in this effort identified an FT-IR spectroscopic detection limit for surface silicone utilizing the area under the 1263 cm-1 (Si-CH3) absorbance peak as a function of concentration (µg/cm2). The next step was to pre-contaminate surfaces with known concentrations of silicone oil and assess the effects on surface wetting and adhesion. This information will be used to establish guidelines for silicone contamination in different manufacturing areas within Harris Corporation... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Harris Corporation

Board-Level Thermal Cycling and Drop-Test Reliability of Large, Ultrathin Glass BGA Packages for Smart Mobile Applications

Technical Library | 2018-08-22 14:05:42.0

Glass substrates are emerging as a key alternative to silicon and conventional organic substrates for high-density and high-performance systems due to their outstanding dimensional stability, enabling sub-5-µm lithographic design rules, excellent electrical performance, and unique mechanical properties, key in achieving board-level reliability at body sizes larger than 15 × 15 mm2. This paper describes the first demonstration of the board-level reliability of such large, ultrathin glass ball grid array (BGA) packages directly mounted onto a system board, considering both their thermal cycling and drop-test performances.

Institute of Electrical and Electronics Engineers (IEEE)


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