Electronics Forum | Thu Sep 11 09:59:47 EDT 2008 | rarnold
Paste stored tip down, so separation in the tube is not suspect. Remember that the defect was produced on a screen printer running with a Rheopump. A few more details are that the strip of the board containing the uncoalesced solder is consistent w
Electronics Forum | Tue Apr 19 13:23:33 EDT 2016 | vchauhan
We are using Vicor SMT J-Lead VI Chip which is big component on the bottom side. The manufacturer recommends to have 6 mil stencil but the customer required 10 mil stencil. The PWB has gold contacts on both sides. We noticed some mini solder splashes
Electronics Forum | Tue Sep 24 12:49:43 EDT 2002 | dragonslayr
Aperture reduction @ 5 mils thickness is your best bet. It may take several attempts to get just the right paste volume. What aperture reduction was specified to the stencil house for these specific LEDS? or was the stencil blindly produced using a
Electronics Forum | Fri Feb 12 19:02:21 EST 1999 | Jon Medernach
|As the squeegee shears the paste at the face of the stencil the vehicle used to contain the solder spheres compresses and expands out the top of the opening after the squeegee passes. This is 1 or 2 mil at most. The peaks should not be considered
Electronics Forum | Mon Aug 24 21:04:58 EDT 1998 | Karlin
| | Hi, | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | We have rule out the possibility of not printing any solder
Electronics Forum | Thu Jun 24 10:11:33 EDT 1999 | Dave F
| Dear guys, | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now usin
Electronics Forum | Thu Jun 24 16:19:46 EDT 1999 | Kennyv
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Tue Aug 25 08:51:16 EDT 1998 | Justin Medernach
| | | Hi, | | | Does anyone has experiences in reflowing Ceramic BGA and found solder wicking ? Solder wicking has the syndrome that solder being wick from the pad and ended up in the leads. | | | We have rule out the possibility of not printing any
Electronics Forum | Thu Jun 24 15:58:46 EDT 1999 | Adam Pratt
| | Dear guys, | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are no
Electronics Forum | Thu Jun 24 23:52:36 EDT 1999 | Dean
| | | Dear guys, | | | | | | I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We
