Industry News | 2009-01-19 00:55:12.0
Garden Grove, CA � January 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it will premier the TS7000 Interchangeable Material Path (IMP) Series Rotary valve in booth 1288 at the upcoming MD&M 2009 West exhibition & conference, scheduled to take place February 10-12, 2009 in Anaheim, Calif.
Industry News | 2010-07-16 16:12:26.0
Krayden, Inc., a leading distributor of engineered materials, announces that it received the Dow Corning Electronics 2009 Distributor of the Year award during a ceremony that was held on May 19, 2010 at its headquarters in Denver. This is the second consecutive year Krayden, Inc. has earned this award.
Industry News | 2014-09-23 11:18:59.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, will present a technical paper at the 9th International Microsystems, Packaging, Assembly, Circuits Technology Conference (IMPACT), Oct. 22-24 in Taipei, Taiwan. Dr. Lee will present Voiding and Reliability of BGA Assemblies Produced with SAC and BiSnAg Solder Alloys.
Industry News | 2017-05-01 15:08:27.0
Specialty Coating Systems (SCS) is pleased to announce that it will participate in a Mechanical Engineering-sponsored webinar on Thursday, May 18, 2017 at 2 p.m. EDT. The webinar, entitled, “Parylene Conformal Coatings: Increasing the Reliability of Complex Technologies,” will be presented by SCS’ Dick Molin, Sr. Medical Market Specialist and Dustin England, Sr. Polymer Chemist. The webinar is now open for registration at: scswebinars.com.
Industry News | 2017-08-08 09:40:33.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2017-08-08 09:40:36.0
(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.
Industry News | 2018-05-08 13:42:49.0
SEMICON WEST 2018 is 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.
Industry News | 2021-01-19 22:00:27.0
The temperature of the neutral particles is close to room temperature, which provides suitable conditions for improving the surface of the thermosensitive polymer. Through low-temperature plasma surface treatment, many physical and chemical changes occur on the surface of the material, or etching occurs, or a dense cross-linked layer is formed, or an oxygen-containing polar group is introduced to make it hydrophilic, adhesive, and dyeable Performance, biocompatibility and electrical properties can be improved.
Industry News | 2023-11-20 15:34:41.0
Indium Corporation was honored with two prestigious GLOBAL Technology Awards during an awards ceremony on November 14 at Productronica in Munich, Germany. The company was honored in both the Flux and Adhesives/Underfills Encapsulants categories for NC-809, a halogen-free, ultra-low residue flip-chip flux, and InTACK™, a drop-in, robust tacking agent for power module assembly, respectively. Presented by Global SMT & Packaging, the Global Technology Awards recognize the best new innovations in the printed circuit assembly and packaging industries introduced in the past 12 months.
Industry News | 2010-08-09 15:22:28.0
“Following a very good start to fiscal 2010, we have now seen our operations continue their successful development in the second quarter, with our Adhesive Technologies and Cosmetics/Toiletries business sectors making a particularly strong contribution..."
