Electronics Forum | Wed May 19 10:48:40 EDT 1999 | Glenn Robertson
| | | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | | All other tips are also welcome. | | | | | | Thanks | | | | | Philip, | | I ha
Electronics Forum | Wed Jan 06 23:49:48 EST 1999 | Chris G.
| Hey All you Einsteins out there!! | | I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring two prototype boards over to rework a BGA socket
Electronics Forum | Thu Oct 18 11:18:46 EDT 2007 | rmitchell
Hi, Anyone have the DRS25 rework machine and use it for lead free BGA's? Anyone upgraded their DRS24 to a DRS25? We may pay to upgrade our 24 to a 25 to improve our Lead Free BGA rework process. Thanks, Rob
Electronics Forum | Fri Oct 19 17:09:56 EDT 2007 | hegemon
We have both DRS24 and DRS25 Lead Free rework is done for the most part on the DRS25, although the DRS24 can handle some of our smaller pbFree assemblies. We bought the DRS25 machine new, it was not an upgrade. The machine is very successful at pb
Electronics Forum | Thu Feb 11 15:07:49 EST 2010 | hegemon
With regards to the rework, size and mass of the PCBs is important, in addition to the size of the components that are to be reworked. You might be in the game with $6K (APE Chipmaster Hot Air machine with Preheater or similar setup) if you have sma
Electronics Forum | Wed May 09 08:25:53 EDT 2012 | almoore
I don't have a placement machine available that will do the job reliably. An Air Vac DRS25 would work well if I had one but I can't afford it. A simple change to the part and cell would allow anyone to rework these parts without expensive equipment
Electronics Forum | Tue Nov 20 19:56:12 EST 2012 | hegemon
In order to be able to do full prototype assembly, you will need to be able to mount and reflow a large number of different devices of differing technology. One part might be a simple QFP, another might be a .4mm pitch uBGA. If you are prototyping a
Electronics Forum | Fri Apr 20 18:21:55 EDT 2007 | Hegemon
Consider how the vast majority of PCBs with BGAs are produced. Forced air convection. Anything that comes closer to duplication of the original soldering profile is what you desire. Did they build it with IR or Convection? The process engineer wa
Electronics Forum | Tue Jun 26 15:36:57 EDT 2007 | bjrap3
The board thickness is 50 thousandths. The style of the BGA is a 324 ball BGA that has an isolated center region. The machine that I am using is the Air-Vac DRS25. I'm not too sure why the pads are being removed when I am desoldering. I know when
Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
