Electronics Forum | Thu Jul 26 23:43:49 EDT 2007 | gioblast
check your stencil design on the ground pad. You might have a big aperture opening that pushing the component away from the paste. Look alos the way your pcb warp. Prioritize side that has component that need flat pcb as much as possible. hope this h
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Wed Sep 29 04:30:27 EDT 1999 | ROBERT
| | Hi All, | | Any one experince BGA-chipset warp about 10-15mil after removing | | from PCB? | | FYI, the rework temperature for preheat was 170C from room | | temperature about 30 seconds, & BGA was removed at temperature | | between 190-200C.
Electronics Forum | Mon Nov 28 09:46:24 EST 2005 | pjc
I have waved gold (ENIG) boards. That's a pretty hot pot at 260C, wow. I have used 245C with good results. All other parameters look OK a glance. Well, PCB temp looks a little hot too at 130C before pot. 90-100C is typical for most No-Clean flux. At
Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Tue Apr 18 19:51:11 EDT 2006 | davef
We don't understand why your aluminum pallet requires high temperature. Is it that you don't want to slow the conveyor?
Electronics Forum | Mon Jun 11 10:07:30 EDT 2007 | jdumont
Search the archives here for info. There is lots of posts on this. Short answer is Kapton isn't the best solution. Try aluminum tape or conductive glue if you don't feel comfortable soldering with high temp stuff.
Electronics Forum | Mon Jun 11 10:12:32 EDT 2007 | ck_the_flip
If you're too lazy to search, the quick answer I can give you: ALUMINUM TAPE! Try it. DoE's have proven, that it's the 2nd best method for T/C attachment. The best is obviously hi-temp solder.
Electronics Forum | Tue Jun 12 06:51:38 EDT 2007 | davef
aluminum and kapton ... [nice words, eh? ;p][Even with the goofball spelling, aluminium gave 30-some postings. ;O] http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=39704
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