Industry News | 2021-03-25 15:48:41.0
The SMTA Officer team is excited to provide our members with a new webinar by Dr. Nathan Blattau, R&D Fellow at Ansys, Inc., on "Next Generation Lead Free Solders for High Reliability and SMT Yield improvement in Client Computing Systems." The webinar will be on Tuesday, April 6th at 12:00 PM EST and will discuss the evolution of lead free (Pb-free) solder, from tin-silver-copper (SAC) system with silver content of 3.0 and 4.0 to low SAC solders and the emergence of high reliability Pb-free solder. It will cover the reasons and the driving forces of industries implementing this change.
Industry News | 2024-02-12 13:44:30.0
In a letter signed by 54 microelectronics executives, IPC and Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
Industry News | 2001-10-26 17:06:52.0
IPC has signed a three-year Cooperative Research and Development Agreement (CRADA) with the Naval Surface Warfare Center, Crane, Ind.
Industry News | 2003-02-05 08:40:13.0
Both SMT Processes and SMT Systems will be Offered from April 1 Through 4
Industry News | 2003-02-07 08:34:04.0
Featuring Individual Instructors who, for Approximately 90 Minutes Each, will Speak on a Timely and Specific Topic
Industry News | 2003-03-17 10:07:23.0
Each program is a three-day workshop consisting of refresher topics and course materials on the first two days and examinations on the third day.
Industry News | 2003-03-20 09:03:05.0
Organizing a Flip Chip and BGA Packaging Technologies Workshop as a part of the SMTA Boston 2003 Conference (June 9-11) at the Bayside Convention Center in Boston, Massachusetts.
Industry News | 2003-04-21 09:11:21.0
One for SMT Processes and one for SMT Systems
Industry News | 2003-06-20 14:01:02.0
Each program is a three-day workshop consisting of
Industry News | 2008-11-14 11:24:40.0
San Jose, CA � The 5th Annual International Wafer-Level Packaging Conference ended 2008 with success, bringing in its highest attendance yet.
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