Electronics Forum: baking pcb (Page 10 of 35)

Water Absorption of PCB

Electronics Forum | Thu Feb 15 21:09:45 EST 2007 | Stephen- SMT engineer trainee

1. Can anyone tell me about the water absorption(wt%) among different PCB((i) RoHS, (ii)non-RoHS, (iii) Halogen free)), I am currently facing the problems of PCB blisters after reflow process. 2. Also, please suggest the baking period/time among dif

PCB Baking after Wash

Electronics Forum | Thu Dec 04 00:22:11 EST 2008 | maacolomer

Hi Steven, The 24 hrs bake is an overkill according with various J-STDs. Assuming a bake temperature over the 100 Celsius degrees. There are several factors to be considered before deciding the best methodology to wash misprinted board. However,

Bakeing

Electronics Forum | Mon Nov 20 06:51:00 EST 2000 | Daniel Carlsson

Does anyone have information regarding: -Moisture level (wt%) that may cause delamination in PCB�s. -Baking time and temperature if using a Vacuum Drying Cabinett and if using an air oven. (What I�m most interested of is Poly-Imid-Aramid.) -Are ther

PCB Delamination

Electronics Forum | Fri Jun 01 04:05:25 EDT 2012 | grahamcooper22

If you think the root cause is excess moisture in the pcb then try to bake it for longer. Even longer then the manufacturers recommendation. It takes a long time for excess moisture to come out of a pcb. Try 24 hours , then 36 hours and see if there

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:26:02 EDT 1999 | John Thorup

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

Voiding in board to BGA joints

Electronics Forum | Sun Mar 07 19:53:38 EST 2004 | praveen

Hello, Voids in BGA can not be eliminated. You can only minimize them by reducing the solder paste volume. Try to bake the plastic BGA's and PCB both as per the standard. Check the PCB at the BGA locations if the via's are masked.Masked via's result

PCB Warp Issues

Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86

I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks

rigid-Flex board via problems

Electronics Forum | Thu Jan 12 13:18:07 EST 2012 | swag

215 to 220 deg.C peak reflow. We bake then store all PCB's in low humidity cabinets (appox. 3% RH) prior to running.

Re: Baking FR-4 PWB's prior to reflow

Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc

Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a

Baking a Populated PCB

Electronics Forum | Fri Jul 30 14:53:01 EDT 1999 | Tom B.

Hello Netters, I have a customer who wants us to aquaeos wash a PCB after all operations have been performed. The PWB is two layer FR4 with a Transformer, a Multichip Module with Conformal Coating, (6) 11" insulated wires that are tinned on exposed


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