Industry News | 2012-10-18 16:35:40.0
IPC — Association Connecting Electronics Industries®, the event brings participants face-to-face with electronics industry experts who have successfully executed lean practices within their own organizations.
Industry News | 2013-10-01 18:16:06.0
A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.
Industry News | 2018-03-22 20:39:49.0
IPC – Association Connecting Electronics Industries®, the global industry association representing the $2 trillion global electronics industry, expressed concern today following President Trump’s announcement that he will impose significantly higher tariffs on electronics imported from China.
Industry News | 2015-09-14 17:15:45.0
ISVI Corp. has announced the official release of its all-new IC-M29S-CL, a monochrome 29 Megapixel CCD camera with a base configuration Camera Link interface achieving 4.45fps.
Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Industry News | 2022-02-10 17:06:48.0
Rafal Przeslawski, Xilinx takes top prize
Industry News | 2019-09-18 16:03:56.0
IPC offers a day-long technical education seminar, Design for Excellence (DFX): DFM (Design for Manufacturing) DFR (Design for Reliability) DFA (Design for Assembly), in conjunction with PCB Carolina November 12, Raleigh, N.C., at the McKimmon Conference and Training Center.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Nordson ASYMTEK's Panorama S-Line delivers conformal coating process control in a compact footprint – with overlapping line processes that minimize manufacturing floor space use up to 50%.
Siemens placement machine D4I, SIPLACE D4i high-speed placement machine Model description: 1. Number of cantilevers: 4 2. Number of placement heads: 4 3. IPC speed: 57.000cph 4. SIPLACE benchmark evaluation: 66.000cph 5. Theoretical speed: 81.50
