Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Fri May 18 13:30:52 EDT 2001 | mparker
I will start with the statement that I think it is great that we have the ability to solder SMT components that emulates wave soldered components. With that in mind, I would want to find acceptance criteria to be similiar, regardless of the solder me
Electronics Forum | Thu Jul 26 22:52:47 EDT 2001 | davef
GT 8 years ago every board saw "touchup". Touch was done to fix boards to conform to A-610. Now A-610 allows less than complete hole fill. Our operators were totally freaking nuts about touching boards. They touched each others touch and on and o
Electronics Forum | Mon Apr 13 12:11:41 EDT 1998 | Justin Medernach
| | | I would like to invite everyone to share/discuss | | information/knowledge/experience they have with | | the req's that are assumed to be valid for the | | temperature/time relation in the process of reflow | | soldering Pin In Paste, Intrusiv
Electronics Forum | Mon Jul 08 11:53:40 EDT 2002 | yngwie
Hi Guys, We prints solder paste on via hole as the holes are used as the test points. This is a clean process. In normal production, upon completion of a primary side, board will proceed to secondary process immediately. The problem happened when
Electronics Forum | Fri Feb 28 08:57:34 EST 2003 | davef
We used to bake [100*C for 6 hours] all of our boards, but no longer bake at all. Before going off, your bake recipe is probaly OK. If anything, it's probably too short. Consider measuring the weight of wet boards, baking for a time, measure, bake
Electronics Forum | Mon Aug 11 17:48:39 EDT 2003 | Brian W.
Assuming you are working to IPC standards, are you working to Class2 or Class 3? Class 2 has an exception to the 75% barrel fill (para 6.3.1, page 6-7). "As an exception to fill requirements of Table 6-2 on PTHs with thermal planes or conductor
Electronics Forum | Fri Sep 19 11:39:38 EDT 2003 | joeherz
We have recently started building a new assembly that is exhibiting some strange behavior. We are seeing what look like blow holes in wave soldered joints. When the joints are touched up, the solder in the barrel will actually bubble up from the ho
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
