Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark
| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew
Electronics Forum | Mon Jul 03 05:39:05 EDT 2006 | ronalds
Hi, I am experience problems while testing wave soldering SMT components that are glued on the solderside (lead free). Between de leads of SOx type IC's and SOT's develop a great deal of solder beads. I have been using a RSS temp.profile while spr
Electronics Forum | Thu Feb 12 10:19:46 EST 2004 | Bryan
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the perf
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Fri Oct 18 12:40:35 EDT 2013 | robertwillis
Back in the mists of time there were two papers on the use of Parylene Coating and the improved thermal cycling results in 1990. It was on LCCC then shortly after on BGA. Does anyone know of results of recent trials or have a copy of the BGA papers.
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Tue Mar 14 21:09:20 EST 2000 | Dave F
Emmanuel: Take Jax's word. NiAu (ENIG) primary (some would say only) redeeming characteristic is its flatness that you mentioned, but that flatness appeals to folk placing fine pitch devices, rather than BGA. Good luck. Dave F
Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson
I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f
Electronics Forum | Fri Jul 12 14:35:03 EDT 2002 | jax
BGA Clamp...... Sounds to technical to me! Not sure about what is needed for installing on IP2, although I am pretty sure it can be done. I have no pic to give. Stop working with FUJI about 5 years ago.
