Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Sun Nov 23 10:03:19 EST 2008 | tsvetan
Hi, yes, you can, but it will be subject to long learn curve where i live there are hundreds of GSM repair shops which do BGA rework and replacement with $50 hot air guns only, but i guess they had lot of BGAs damaged before they have learned how to
Electronics Forum | Wed Apr 27 15:13:24 EDT 2005 | jdumont
If square apertures are supposedly better than round why arnt we using them for all BGA locations, even the larger ones?
Electronics Forum | Tue May 03 05:46:43 EDT 2005 | mattkehoe
Consider ssd for your BGA's. http://www.sipad.com/SIPAD_NASA_Plots.htm www.sipad.net mkehoe@sipad.net
Electronics Forum | Fri Oct 07 09:19:54 EDT 2005 | Kris
the direction in which the solders cool in a BGA are also different than the rest of the boards as the joints " hidden" to ambient. Refer to an analogus phenomenon in the cookson application note. http://www.cooksonsemi.com/pdfs/How%20&%20Why%20Bum
Electronics Forum | Wed Apr 27 18:07:12 EDT 2005 | russ
no problems with release on the larger ones.
Electronics Forum | Thu Apr 28 21:47:18 EDT 2005 | KEN
You just found your problem. And yes, I have had experience with this material.
Electronics Forum | Thu Jul 10 22:46:08 EDT 2008 | davef
We'd like to see pads on the board that closely resemble those on the interposer.
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
