696 bga pads with unplugged vias under the pad results

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

The Environmental Cost of Green

Organic Optical Waveguide Fabrication in a Manufacturing Environment

The Environmental Cost of Green

Head-in-Pillow BGA Defects

Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint

SMTnet Express - July 14, 2022

SMTnet Express - August 10, 2017

SMTnet Express, August 10, 2017, Subscribers: 30,696, Companies: 10,656, Users: 23,635 High Frequency Electrical Performance and Thermo-Mechanical Reliability of Fine-Pitch, Copper - Metallized Through-Package-Vias (TPVs) in Ultra - thin Glass

SMT Express, Volume 4, Issue No. 11 - from SMTnet.com

Modelling of Thermal Stresses in Printed Circuit Boards

Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers