Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Thu Apr 26 16:52:53 EDT 2001 | fmonette
Robert, Someone already mentioned the popcorning phenomena. This would show up as a dome-shaped deformation underneath the component, due to internal delamination around the die area. However what you describe sounds like another moisture-related
Electronics Forum | Mon Jun 18 15:54:25 EDT 2001 | Gil Zweig
For BGA inspection, it is my feeling that he most effective technique a facility can use is the combination of a transmission x-ray system in conjunction with an endoscope (side viewing optical microscope). In using the transmission x-ray inspection
Electronics Forum | Thu Jan 14 08:32:22 EST 1999 | Jim Nunns
They are supposed to be production parts. Our volumes are in the hundreds due to rapid change though. Jim Nunns | Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype"
Electronics Forum | Tue Jan 04 10:00:19 EST 2005 | Carmichael
No mystery there... The balls are reflowed by conduction of heat from the package itself and the backside preheater just as in any other rework machine. The laser is just another method of precisely heating the entire package. The advantage is overa
Electronics Forum | Thu Jan 19 06:25:42 EST 2006 | bwet
There are several life studies (see for example http://www.solder.net/stencilquik/articles.asp) which point to higher reliability of reworked BGAs using solder paste vs flux. The theory on the mechanisms which allow this to happen are as follows: 1
Electronics Forum | Fri Mar 17 16:58:52 EST 2006 | mikecollier
We are currently struggling with a particularly difficult component selection form our designers. This is a custom BGA, 592 balls, metal cover with a very large bead of adhesive using to retain the cover. We have had significant fallout (greater th
Electronics Forum | Fri Aug 20 14:51:47 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 14:51:55 EDT 1999 | Tony
| | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | This is what I did. | | | | | | Created a
Electronics Forum | Fri Aug 20 17:17:14 EDT 1999 | K.T
| | | | Yesterday as I was creating a profile on a plastic BGA using Conceptronics freedom 2000 rework station, I happend to discover that I was able to remove solder bridging from a plastic BGA. | | | | | | | | This is what I did. | | | | | | | |
