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PGB-200 Dispensing machine equipment for epoxy resin filling machine AB component glue potting machine epoxy application Whatsapp +86 134 2516 4065 Model: PGB-200 PGB-200-800 system accur
New Equipment | Design Services
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About the machine please contact whatsapp 0086 134 2516 4065 PGB-810system accurately meters, mixes and dispenses two-component medium to low-viscosity materials for potting, gasketing,sealing, encapsulation and syringe filling. For variable ratio
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Industry News | 2001-06-26 09:50:17.0
The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.
Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
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New Equipment | Test Equipment - Bond Testers
Fully integrated solution for automated wafer testing (up to 300 mm). The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level. The system has the largest X/Y and fastest stages av