New Equipment | Assembly Services
Suitable for OE 7200HD,7600HD,7200 Plus machine. Specification: 5/6/8/10/12/15/16/18/20 mil OEM service available.Factory price. Contact: yoyogong@yehengdz.com
New Equipment | Rework & Repair Equipment
TFT-LCD Laser Repair Machine Support TFT-LCD LED Panel From 5′ – 80′ Including Mobile, Tablet, Laptop, Smart TV Screen. LCD Screen Resolution Support 1080P, 2K, 4K, 5K Support LCD Bad Point, Line, Block Repair Laser Head From Canada, Long Life
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product des
http://www.flason-smt.com/product/Yamaha-Flip-Chip-Bonder-and-Hybrid-Placer.html Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product descrip
Industry News | 2022-06-02 06:56:41.0
PVA is pleased to announce that it received a new patent in Japan for "optical bonding machine having cure in place and visual feedback." The new patent is based upon a machine and method designed specifically for applying a UV cure liquid optically clear adhesive used for bonding cover glass and/or sensors to touchscreens used most commonly in automotive, aerospace, military and medical applications. Key features covered by the patent are related to machine design and methods used.
Easy plasma evaluation for as little as €3.00 by “color.” The indicator brings simplicity to plasma evaluation. Industry first technology can realize evaluation of in-plane distribution and 3d object. Very suitable for daily plasma
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bond, Yamaha
New Equipment | Selective Soldering
Laser Selective Reflow (LSR) uses a uniform defocused laser beam over a specifically tailored area on a PCB with controlled beam intensity to implement novel soldering on specific component(or several components) while not heating up potentially the
New Equipment | Test Equipment - Bond Testers
Nordson DAGE’s intelligent bond testing software Paragon™ takes bond testing to the next level. Its highly intuitive and configurable interface provides quick and easy access to advanced functionality, such as automatic GR&R calculation, built-in dia
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
