Electronics Forum: bowing and boards (Page 10 of 100)

MPM Up2000 and SMEMA

Electronics Forum | Tue Sep 13 10:00:27 EDT 2016 | awhite

Switched out the mech. relay on the board loader, no change. Same behavior. Could not find a mech. relay on the printer... SMEMA wiring appears go directly to a PCB. And it is at that point that I run out of talent. If the machine weren't dedicate

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

Re: Paste-in_hole and CTE

Electronics Forum | Thu Jul 27 21:34:41 EDT 2000 | Dave F

Gary: That's curious. Tell us more about your process steps, temperature profiles, paste, warping of the board without the PIH processing, components, etc

black and grey pad

Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef

Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.

Post- and pre-reflow rework

Electronics Forum | Tue Jan 04 08:02:54 EST 2005 | Mike

Hi!! Where can I get information about Post- and pre-reflow rework? Some links, opinions?? Please Tell me? I would like to know too some methods and cost effective ways,that how we can rework repair printed boards? Thanks!!

Immersion gold and BGAs

Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya

I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.

Tg and reflow

Electronics Forum | Mon Dec 19 07:29:30 EST 2005 | jax

Tg is just a way to say when the board goes limp... or a quick way to rank laminates... who cares. For lead free you want to look at Td, Decomposition Temperatures. ( Temp at which the material weight changes by 5% )

Tg and reflow

Electronics Forum | Mon Dec 19 12:21:09 EST 2005 | Amol Kane

from what i know, Tg is important from thermal stresses point of view. board warpage increases greately when Tg is exceed

Solder Balls and Humidity

Electronics Forum | Fri Aug 24 12:39:59 EDT 2007 | hussman

I would say no, unless your machine is in extremeconditions. You may want to check your flux / preheat out as well. If you are leaving a lot of flux on the board at wave, it may be boiling - which can cause solder balls.

Td and Tg

Electronics Forum | Wed Aug 27 13:08:30 EDT 2008 | vladig

Td - is the degradation temperature for a laminate (board), while Tg - is glass transition one. There is one more (even more important) - delta Tg. They characterize the quality of the laminate material. Regards, Vlad www.sentec.ca


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