Electronics Forum | Wed Jul 31 13:19:38 EDT 2013 | anvil1021
Does anyone know how to test for hard gold on a PCB? We are in a challenging situation with a PCB provider and we need some objective evidence other than wire bond failure to present to them. Any comments could help ....Thank you Anvil
Electronics Forum | Wed Apr 21 12:03:59 EDT 1999 | Michael N.
I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is about
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure
Electronics Forum | Wed May 09 17:26:57 EDT 2001 | davef
Awww, don beso tuff on ursef!!! It sounds like you�re thinking correctly with what you�ve done, but it�s possible that the test you ran did not represent your actual production environment as well as you would have liked. So, you just need to "cran
Electronics Forum | Sun Dec 03 15:35:44 EST 2000 | Michael Nguyen
Wow. And I thought I was the only one having problem with ceramic capacitors.I too am having problem with cracking ceramic capacitors 1206 package.We changed vendors and still having the same problem. I had to reverify my entire process and I had to
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Wed Jan 02 13:31:55 EST 2002 | PeteC
The rule-of-thumb is to follow the flux mfg.'s recommended profile to achieve their specified top side PCB temperature before making contact with the wave. Typical top side PCB temps are 100-120deg.C. Your wave contact time should be around 2 seconds
Electronics Forum | Wed Apr 18 08:14:20 EDT 2007 | davef
Silver palladium termination * AgPd-terminated capacitors are designed for conductive adhesion. Reflow or wave soldering is not recommended. [EPCOS Multilayer ceramic capacitors, Soldering directions, October 2006] * CONDUCTIVE EPOXY BONDING. Epoxy c
Electronics Forum | Mon Jun 03 12:51:17 EDT 2002 | V.RAMANAND KINI
We are doing COB operations for nearly ten years. Pls. write to me if you need info on m/c selection, type of PCB, plating etc., Thanks V.RAMANAND KINI...03.06.02
Electronics Forum | Tue Jul 31 06:33:58 EDT 2001 | nifhail
What is the industry standard specification for Resisitivity monitoring at aqueous cleaning? What would be the diff. between specs. for normal PCBA vs PCB that has to go through wire bonding after SMT for COB process. pls advise..thx
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