Industry News: clamping (Page 10 of 15)

Essemtec to Highlight EXPERT-SAFP with BGA Placer at SMTA Long Island Expo and Technical Forum 2011

Industry News | 2011-09-01 22:08:39.0

Essemtec will exhibit Swiss Made, highly flexible SMD placement systems for prototyping and low volumes at the upcoming SMTA Long Island Expo and Technical Forum.

ESSEMTEC AG

Viscom to Highlight Desktop AOI S2088-II at SMTA International 2011

Industry News | 2011-09-21 13:27:22.0

Viscom introduces the S2088-II desktop AOI inspection system to the US market. This new system is designed for automatic optical inspection of paste print, pre- and post-reflow and THT solder joints.

Viscom AG

Nordson DAGE Wins A 2011 Global Technology Award for its 4000Plus Bondtester Pad Cratering Inspection System

Industry News | 2011-11-20 13:14:27.0

Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.

Nordson DAGE

DEK and Interlatin Take Productivity on Tour to Overwhelming Response

Industry News | 2011-12-02 21:39:53.0

Over the past month, DEK and its Mexican-based representative, Interlatin, have embarked on a Productivity Solutions Tour that has so far hosted four events in three cities and attracted nearly 150 customers. Setting up shop in Guadalajara, Monterrey, Tijuana and early next month in Ciudad Juarez, Mexico, the technology-rich Productivity Solutions Tour program is effectively enabling assembly specialists to get even more out of their print processes.

ASM Assembly Systems (DEK)

Nordson DAGE to Exhibit Hot Bump Pull/Hot Pin Pull Technology at ECTC San Diego

Industry News | 2012-05-01 19:12:41.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its 4000Plus Bondtester Pad Cratering Inspection System in Booth #212 at the upcoming Electronic Components and Technology Conference

Nordson DAGE

Juki to Participate in PoP Center during SMTA International

Industry News | 2012-09-10 10:44:36.0

Juki Automation Systems, will participate in the Package-on-Package (PoP) Design and Assembly Center during the annual SMTA International conference, scheduled to take place October 14-18, 2012 in Orlando, FL.

Juki Automation Systems

Fuji Expands Printer Line-up with NXTP-M35

Industry News | 2013-01-22 01:29:07.0

Fuji has released the NXTP M35 printer, which expands the supported panel size of this printer series to 350 x 300 mm (13.7 x 11.8 inches). The latest addition to the Fuji line-up has all the benefits of the previously released NXTP M25, but with a wider body for handling medium sized panels.

FUJI CORPORATION

GKG Asia Announces a Successful productronica Exhibition in Germany

Industry News | 2013-11-20 16:52:27.0

GKG Asia Pte Ltd announces that it participated in the recent productronica exhibition that took place November 12-15, 2013 in Munich, Germany and reports that the show was a complete success.

GKG Asia Pte Ltd

High-Precision, High-Mix, Print-Place-Reflow Package Under $47K

Industry News | 2014-01-30 17:35:39.0

Manncorp has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printers, pick and place machines, and reflow ovens, to accommodate a wider range of production levels and budgets. Among the ten different turnkeys presented on their website at www.manncorp.com/turnkeys is the new 2500-MV package. Priced at only $46,995, the 2500-MV is designed for companies with a limited budget and minimal floor space who need short-run, in-house production capability for ultra-precise, high component-mix SMT assembly.

Manncorp

GKG Asia and Juki Win NPI Award for Screen/Stencil Printing Equipment

Industry News | 2014-03-25 19:17:13.0

GKG Asia Pte Ltd, and Juki Automation Systems (JAS), Inc. today announced that they won a 2014 NPI Award in the category of Screen / Stencil Printing for the Fully Automatic Screen Printer.

GKG Asia Pte Ltd


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