Electronics Forum: class 3 (Page 10 of 38)

X-ray interpretation courses

Electronics Forum | Thu Feb 10 11:40:25 EST 2005 | Carol

Hello All, Can somebody direct me to a facility or school or even a business that can offer an x-ray course for Class 3 electronic circuit board population interpretation, as in BGA ball acceptance, connector solderability fill acceptance etc.? Some

lead free pcb plating?

Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef

There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,

Part coating flowing into solder joints

Electronics Forum | Fri Oct 22 18:57:25 EDT 2010 | jry74

I am having a horrible time with the square radial lead capacitors (thru hole components) and the part coating flowing into the solder joint. These are Class 3 products. When we run them through the wave solder machine, the solder travels up the le

Butt connector

Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef

From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 08:54:06 EST 2001 | dblsixes

I'm not familiar with Laser Soldering. I don't believe it to be a problem with the QFP themselves, since the two plastic parts are from different vendors in the same package. We also are having similar problems with other plastic parts on other boa

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 16:02:37 EST 2001 | dblsixes

In the end, we may have to go to our customer to see if we can get Class 3 relief ... We actually did an experiment by adding a ceramic cap to the top of the part, using a thermal paste to improve the thermal connection. It didn't do much for us ..

Standards &/or Specifications for PBGA Assembly/Inspection

Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling

We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.

PBGA Replacement

Electronics Forum | Mon Sep 22 10:52:14 EDT 2003 | Carol

Is there a standard that tells you how many times you can replace a PBGA without reliability issues? I've read IPC-7095 (many times) and have not found a recommendation for this. We have Class 3 products.My thoughts are 2 times max. We place PBGAs

SM termination with Nickel barrier with 100% tin plated finish

Electronics Forum | Tue Nov 11 12:49:13 EST 2003 | Carol

Could you direct me to a Standard or Study that has used this termination with 67/37 tin/lead solder please? I am looking for the recommended reflow temperature requirements and reliability issues for the completed product. We are receiving this type

What standards should electronic manufacturing meet?

Electronics Forum | Fri Mar 19 13:42:05 EST 2004 | blu_nozer

J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standard & includes photographs of compliant and non-compliant examples. In addition there is also IPC-HDBK-001 which expands on the bare requirements laid d


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