Industry News | 2021-02-04 09:08:44.0
Growing Demand for Printed Circuit Board Assemblies Prompts Acquisition of New Equipment
Industry News | 2021-11-17 15:21:10.0
CyberOptics® Corporation (NASDAQ: CYBE) received a 2021 GLOBAL Technology Award in the category of Metrology for its WX3000™ Metrology and Inspection System. The award was announced during a ceremony that took place Tuesday, Nov. 16, 2021 at Productronica in Munich, Germany.
Industry News | 2016-04-26 11:11:11.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, sees a significant increase in demand for its redesigned line of Surface Insulation Resistance Testers (AutoSIR) and Conductive Anodic Filament Monitoring Testing System (AutoCAF).
Industry News | 2016-05-05 20:33:25.0
Mentor Graphics Corporation (NASDAQ: MENT) today announced a comprehensive product-creation platform based on PADS® PCB software that enables individual engineers and small teams to solve the engineering challenges involved in creating today’s electronic products. With increasing systems design complexity and the need for printed circuit board (PCB), mechanical and systems engineers to access easy-to-deploy tools, the PADS platform has been extended to enable engineers to develop PCB-based systems from concept through manufacturing hand-off.
Industry News | 2018-05-31 10:23:37.0
Nordson MARCH announces that it has received the VISION Award from SMT China magazine and the Innovation Award from Electronics Manufacturing (EM) Asia magazine for its new-generation RollVIA™ plasma system. The awards were presented at NEPCON China, held in the Shanghai EXPO World Center, Shanghai, China, on April 24 and 25, 2018. The RollVIA™ plasma system is used for plasma applications such as surface activation for improved adhesion, carbon removal and descum/desmear for cleaner surfaces, and etchback, which removes a slight amount of dielectric contamination between internal copper planes during printed circuit board (PCB) production. The RollVIA provides uniform plasma treatment of substrates as thin as 25 microns.
Industry News | 2008-01-31 00:10:18.0
GREELEY, CO � January 29, 2008 � FCT Solder, a division of FCT Assembly, and Nihon Superior USA, a subsidiary of Nihon Superior Co. Ltd., announce that it will exhibit SN100C� Lead-Free products paste in booth 213 at the upcoming IPC International Conference on Flexible Circuits, scheduled to take place February 12-14, 2008 in Phoenix, Ariz.
Industry News | 2016-03-10 19:12:32.0
Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Industry News | 2012-05-30 13:50:20.0
Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.
Industry News | 2017-02-14 19:47:02.0
Seica will be exhibiting at the Apex show held in San Diego this year showing our expanding lines of test and assembly equipment. The automated Pilot4DV8 will be showcased fully automated in a batch line environment. The automated solution will demonstrate a magazine and conveyance solution that will allow customers to load different board part numbers for automated testing.
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
