Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Thu Jul 05 10:45:01 EDT 2001 | dougie
Steven, There is a load of info on this if you check through the archives. Quick pointer though are: Solder balls are caused by paste creeping under the component at placement. The part is placed and the paste is squashed under the component, when t
Electronics Forum | Tue Jul 31 13:55:27 EDT 2001 | mparker
Maintain DI water to 18 Meg Ohms resistivity. You can go down as low as 2 Meg ohms, in a pinch, but I would caution on what type of board you are running if trying to clean on 2 Meg ohm. Anything that is running an RF or high frequency circuit could
Electronics Forum | Tue Feb 03 09:36:05 EST 2004 | davef
Unfortunately, IPC-D-279, IPC-TM-650, IPC-TR-464, and MIL-STD-810 will not answer your questions, because they do NOT address LF-solders. Even the tests in IPC-9701 need to be modified for LF-solders, because: * LF-solder has different creep behavior
Electronics Forum | Thu Mar 25 18:54:16 EST 2004 | Mike Konrad
A surfactant (AKA detergent) is great for OA flux removal applications. It has a good surface tension reducing property and is more easily rinsed than soaps. If using a soap or surfactant, be sure that you choose one that has a good de-foaming pack
Electronics Forum | Wed Apr 07 09:23:20 EDT 2004 | davef
In addition to your concerns about leaching, why aren't you concerned about: * Tin whiskers * Total absence of in use reliability information about no-lead, especially given that creep is significantly different between SnPb and no-leads. While they
Electronics Forum | Thu Sep 23 14:58:50 EDT 2004 | C Lampron
EMS-Engineer, Lead free alloys have a very low wetting creep. You probably will not ever get the same type of weting with a LF as opposed to SN 63/37. The question is if it is acceptable. Lead free solder joints cannot be inspected to the same crite
Electronics Forum | Thu Sep 01 11:18:16 EDT 2005 | patrickbruneel
Steve, Let me try to give you a short answer to your question. A good book in soft soldering would talk about the excellent characteristics of leaded alloys and all the reasons why leaded alloys are very reliable. In short a good book would advice y
Electronics Forum | Tue Nov 21 09:46:19 EST 2006 | jax
I assume you are talking about Sn62Pb36Ag2 solder. You should not see any added concerns when subjecting Sn62 to multiple reflow cycles as compared to Sn63. As compared to Sn63Pb37: Reduced leaching issues Increased Wetting due to lo
Electronics Forum | Wed Jun 18 01:47:25 EDT 2008 | sleech
Innovative Drying Co., considered this possibility early in our experiments. The rate of chamber pump-down is not a consideration. However, the selection of the vacuum pump is critical. Avoid oil-sealed pumps at all costs. A poorly maintained oil-tra
