Electronics Forum: date code (Page 10 of 13)

Voids in solder fillet

Electronics Forum | Wed Apr 16 16:55:38 EDT 2003 | russ

Thanks for the info, Here is a couple more questions (and you thought you were done) What size are these caps /res? how thick is your stencil? what type of oven are you using? what is the finish of the board? Anyway, it seems like (from a distance)t

facing cold joint problem

Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf

How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t

Baking for delam prevention

Electronics Forum | Wed Nov 16 18:44:54 EST 2005 | Mike F

A good board used soon after you receive it should not delam. If only a small percentage is doing that I urge you to do some more looking at the board quality while you do the baking. Do a search of the archives on baking boards, Dave F had some good

QFN soldering

Electronics Forum | Mon Nov 12 09:37:17 EST 2007 | russ

You need to perform process a capability study prior to putting these controls into place. Cleaning a stencil after each pass will get ugly, solvent residues remaining in apertures etc. 2D inspection is good. Change paste every hour will get very

board delaminated after reflow

Electronics Forum | Wed Apr 08 14:46:34 EDT 2009 | boardhouse

The things to ask your board supplier would be: 1) Was the Pre-preg material that was used on this board within its Shelf life? and ask for the Incoming inspection CofC for the Pre-preg material. 2)Was this order shipped from Stock - this is why

SMT RFID - Is it reality?

Electronics Forum | Fri Jun 05 00:09:31 EDT 2009 | operator

I have been trying to get in touch with TI about their SMT RFID chips. I want to learn more about its capabilities and everything involved. I have read many articles on RFID in general, but finding specific info on the SMT application has been diffic

White spots on PCBA after Selective Solder

Electronics Forum | Fri Sep 11 15:27:50 EDT 2015 | u4bga

Hi! We're noticing white spots on 2 PCBAs after the selective soldering & DI Wash processes. ----Facts---- 1) The marking is on all boards, irrespective of date code 2) It only happens on leads that have been selective soldered 3) The pattern of w

Laser Marking

Electronics Forum | Tue Aug 30 11:23:07 EDT 2005 | g2garyg2

AJ, there are a variety of laser marking systems in the marketplace. Most use a CO2 laser to mark PCBs. Since laser life is directly related to power available vs power used, you should try to get a system with a 30 watt power rating. Most marking i

procedure to define programmable IC marking

Electronics Forum | Mon Nov 19 18:58:28 EST 2007 | jmelson

On big chips, we use a tape printing device, I think it is a Brother PT1750. We have a small device, though, that is in an SO8 package, and the only thing we've come up with is to scratch a product letter code and the program date with a stylus. Th

BGA failure at Functional Test

Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70

Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f


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